參數(shù)資料
型號(hào): CAP1014-1-EZK
廠商: STANDARD MICROSYSTEMS CORP
元件分類(lèi): 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, QCC32
封裝: 5 X 5 MM, 0.50 MM PITCH, ROHS COMPLIANT, QFN-32
文件頁(yè)數(shù): 4/73頁(yè)
文件大小: 945K
代理商: CAP1014-1-EZK
Multiple Channel Capacitive Touch Sensor and LED Driver
Datasheet
Revision 1.64 (01-15-09)
12
SMSC CAP1014
DATASHEET
Chapter 2 Electrical Specifications
Note: Stresses above those listed could cause permanent damage to the device. This is a stress
rating only and functional operation of the device at any other condition above those indicated
in the operation sections of this specification is not implied.
Note 2.1
The Package Power Dissipation specification assumes a recommended thermal via design
consisting of four 12mil vias connected to the ground plane with a 3.3 x 3.3mm thermal
landing.
Note 2.2
Junction to Ambient (
θ
JA) is dependent on the design of the thermal vias. Without thermal
vias and a thermal landing, the
θ
JA is approximately 52°C/W including localized PCB
temperature increase.
Table 2.1 Absolute Maximum Ratings
Voltage on 5V tolerant pins
-0.3 to 5.5
V
Voltage on VDD pin
-0.3 to 4
V
Voltage on any other pin to GND
-0.3 to VDD + 0.3
V
Package Power Dissipation up to TA = 85°C (see Note 2.1)1
W
Junction to Ambient (
θ
JA) (see Note 2.2)40
°C/W
Operating Ambient Temperature Range
-40 to 125
°C
Storage Temperature Range
-55 to 150
°C
ESD Rating, All Pins, HBM
8000
V
Table 2.2 Electrical Specifications
VDD = 3V to 3.6V, TA = 0°C to 100°C, all Typical values at TA = 27°C unless otherwise noted.
CHARACTERISTIC
SYMBOL
MIN
TYP
MAX
UNIT
CONDITIONS
DC Power
Supply Voltage
VDD
3.0
3.3
3.6
V
Supply Current
ISLEEP
TBD
250
uA
Sleep Mode active, 2 sensors
monitored
IDSLEEP
TBD
100
uA
Deep Sleep or Deact modes
active
IDD
TBD
1
mA
Average current
Capacitive Sensing Active,
LED’s enabled
Capacitive Touch Sensor
Base Capacitance
CBASE
5
15
50
pF
Pad untouched
Detectable
Capacitive Shift
ΔC
TOUCH
0.1
0.4
2
pF
Pad touched
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