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| 型號(hào)： | BXM80526B650256 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 650 MHz, MICROPROCESSOR, CPGA495 |
| 封裝： | MICRO PGA-495 |
| 文件頁(yè)數(shù)： | 43/84頁(yè) |
| 文件大小： | 450K |
| 代理商： | BXM80526B650256 |
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Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet
Intel Corporation
40
5.0
Mechanical Specifications
5.1
Surface-mount BGA2 Package Dimensions
The mobile Pentium III processor is packaged in a PBGA-B495 package (also known as BGA2)
with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Pentium III processor die may be polished and very smooth.
The mechanical specifications for the surface-mount package are provided in Table 29. Figure 21
shows the top and side views of the surface-mount package, and Figure 22 shows the bottom view
of the surface-mount package. The substrate may only be contacted within the shaded region
between the keep-out outline and the edge of the substrate. The mobile Pentium III processor will
have one or two label marks. These label marks will be located along the long edge of the
substrate outside of the keep-out region and they will not encroach upon the 7-mm by 7-mm
squares at the substrate corners. Please note that in order to implement VID on the BGA2 package,
some VID[4:0] balls may be depopulated.
Table 29. Surface-mount BGA2 Package Specifications
Symbol
Parameter
Min
Max
Unit
A
Overall Height, as delivered
2.29
2.79
mm
A1
Substrate Height, as delivered
1.50 REF
mm
A2
Die Height
0.854 REF
mm
b
Ball Diameter
0.78 REF
mm
D
Package Width
27.05
27.35
mm
D1
Die Width
9.22 REF
mm
E
Package Length
30.85
31.15
mm
e
Ball Pitch
1.27
mm
E1
Die Length
11.18 REF
mm
N
Ball Count
495
each
S1
Outer Ball Center to Short Edge of Substrate
0.895 REF
mm
S2
Outer Ball Center to Long Edge of Substrate
0.900 REF
mm
PDIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
4.5 REF
grams
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