參數(shù)資料
型號(hào): BX805499040
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 1600 MHz, MICROPROCESSOR, CPGA611
封裝: PGA-611
文件頁(yè)數(shù): 71/108頁(yè)
文件大?。?/td> 2315K
代理商: BX805499040
Dual-Core Intel Itanium Processor 9000 Series Datasheet
65
Mechanical Specifications
4
Mechanical Specifications
This chapter provides the mechanical specifications of the Dual-Core Intel Itanium 2
processor 9000 series.
4.1
Processor Package Dimensions
Figure 4-1 through Figure 4-5 provide package mechanical drawings and dimensions of
the processor. Table 4-1 and Table 4-2 provide additional details on the package
dimensions. Main components of processor package are identified in Figure 4-2. All
specified package dimensions are in millimeters.
Figure 4-1 illustrates key package mechanical features. These features enable package
integration with socket, power pod, and cooling solution.
Vcore, Vcache, Vfixed, GND, and VID Pads: Contact pads for delivering power
and I/O signals from the voltage regulator to the processor through its substrate.
Socket Alignment Keyways: They define package position in X and Y direction
with respect to socket for proper alignment of package pins to socket contact holes.
Pin Shroud Alignment Keyways: They define pin shroud position in X and Y
direction with respect to processor.
Pin 1 Indicators: Identifies package orientation with respect to socket and
motherboard.
Integrated Heat Spreader (IHS): Enhances dissipation of heat generated by the
processor. Provides interface surface between processor and cooling solution.
Substrate: Processor mechanical and electrical integration vehicle with the
motherboard and processor enabling components.
Pin Field (Grid): 28 x 25 partially filled pin field for transmitting signals to and
from processor to motherboard.
Voltage Regulator Connector Back Plate Keyway: They define the VR
connector back plate position in X and Y direction with respect to the processor.
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