參數資料
型號: BX80532PG3000D
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 3000 MHz, MICROPROCESSOR, XGA478
封裝: BOXED PROCESSOR
文件頁數: 68/88頁
文件大?。?/td> 1502K
代理商: BX80532PG3000D
70
Intel Pentium 4 Processor on 0.13 Micron Process Datasheet
Thermal Specifications and Design Considerations
NOTES:
1. These values are specified at VCC_MAX for the processor. Systems must be designed to ensure that the
processor is not subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified
ICC. Refer to loadline specifications in Chapter 2.
2. The numbers in this column reflect Intel’s recommended design point and are not indicative of the maximum
power the processor can dissipate under worst case conditions. For more details, refer to the
Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines
.
3. TDP and TC are specified for highest VID only. Processors will be shipped under multiple VIDs for each
frequency; however, the TDP and TC specifications will be the same as highest VID specified in the table.
5.1.2
Thermal Metrology
5.1.2.1
Processor Case Temperature Measurement
The maximum and minimum case temperature (TC) for the Pentium 4 processor on 0.13 micron
process is specified in Table 5-1. This temperature specification is meant to help ensure proper
operation of the processor. Figure 5-2 illustrates where Intel recommends TC thermal
measurements should be made. For detailed guidelines on temperature measurement methodology,
refer to the Intel Pentium Processor 4 with 512-KB L2 Cache on 0.13 Micron Process Thermal
Design Guidelines.
Figure 5-2. Guideline Locations for Case Temperature (TC) Thermocouple Placement
Measure Tcase
At this point
Thermal Interface
Material should cover the
entire surface of the
Integrated Heat Spreader
0.689”
17.5 mm
0.689”
17.5 mm
35 mmPackage
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