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參數(shù)資料
| 型號(hào)： | BX80532PG3000D |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, XGA478 |
| 封裝： | BOXED PROCESSOR |
| 文件頁數(shù)： | 65/88頁 |
| 文件大?。?/td> | 1502K |
| 代理商： | BX80532PG3000D |
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Intel Pentium 4 Processor on 0.13 Micron Process Datasheet
Thermal Specifications and Design Considerations
5.1
Processor Thermal Specifications
The Pentium 4 processor on 0.13 micron process requires a thermal solution to maintain
temperatures within the operating limits as set forth in Section 5.1.1. Any attempt to operate the
processor outside these operating limits may result in permanent damage to the processor and
potentially other components in the system. As processor technology changes, thermal
management becomes increasingly crucial when building computer systems. Maintaining the
proper thermal environment is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component-level thermal solutions can include active or passive heatsinks attached to the
processor IHS. Typical system level thermal solutions may consist of system fans combined with
ducting and venting.
For more information on designing a component level thermal solution, refer to Intel Pentium 4
Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 6.3. To ensure maximum flexibility
for future requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BX80532PG3200D | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 3.2GHZ - Boxed Product (Development Kits) |
| BX80532PG3200F | 制造商:Intel 功能描述:MPU PENTIUM 4 NETBURST 64-BIT 0.13UM 3.2GHZ - Boxed Product (Development Kits) |
| BX80532PG3400F | 制造商:Intel 功能描述:MPU PENTIUM 4 PROCESSOR 64-BIT 0.13UM 3.4GHZ 775-PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80532RC2000B | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 0.13UM 2GHZ - Boxed Product (Development Kits) |
| BX80532RC2100B | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 0.13UM 2.1GHZ 478-PIN FCPGA2 - Boxed Product (Development Kits) |
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