參數(shù)資料
型號(hào): BX80532PG3000D
廠商: INTEL CORP
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 3000 MHz, MICROPROCESSOR, XGA478
封裝: BOXED PROCESSOR
文件頁(yè)數(shù): 23/88頁(yè)
文件大小: 1502K
代理商: BX80532PG3000D
Intel Pentium 4 Processor on 0.13 Micron Process Datasheet
3
Contents
Introduction ..................................................................................................................9
Terminology.........................................................................................................11
Processor Packaging Terminology.........................................................11
Electrical Specifications........................................................................................15
System Bus and GTLREF ...................................................................................15
Power and Ground Pins ......................................................................................15
Decoupling Guidelines ........................................................................................16
VCC Decoupling .....................................................................................16
System Bus AGTL+ Decoupling.............................................................16
Voltage Identification ...........................................................................................16
Phase Lock Loop (PLL) Power and Filter...............................................18
Reserved, Unused Pins, and TESTHI[12:0]........................................................20
System Bus Signal Groups .................................................................................21
Asynchronous GTL+ Signals...............................................................................22
Test Access Port (TAP) Connection....................................................................22
Maximum Ratings................................................................................................23
Processor DC Specifications...............................................................................23
AGTL+ System Bus Specifications .....................................................................35
Package Mechanical Specifications.................................................................37
Pin Lists and Signal Descriptions.....................................................................45
Signal Descriptions..............................................................................................58
Thermal Specifications and Design Considerations.................................67
Processor Thermal Specifications.......................................................................68
Thermal Specifications ...........................................................................68
Thermal Metrology .................................................................................70
5.1.2.1 Processor Case Temperature Measurement ............................70
6Features .......................................................................................................................71
Power-On Configuration Options ........................................................................71
Clock Control and Low Power States..................................................................71
Normal State—State 1 ...........................................................................71
AutoHALT Powerdown State—State 2...................................................72
Stop-Grant State—State 3 .....................................................................73
HALT/Grant Snoop State—State 4 ........................................................73
Sleep State—State 5..............................................................................74
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