參數(shù)資料
型號: BUK752R3-40C
廠商: NXP Semiconductors N.V.
元件分類: 功率晶體管
英文描述: N-channel TrenchMOS standard level FET
中文描述: N溝道TrenchMOS標準電平場效應(yīng)管
封裝: BUK752R3-40C<SOT78A (TO-220AB)|<<http://www.nxp.com/packages/SOT78A.html<1<Always Pb-free,;
文件頁數(shù): 7/14頁
文件大?。?/td> 222K
代理商: BUK752R3-40C
BUK752R3-40C_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 26 January 2009
7 of 14
NXP Semiconductors
BUK752R3-40C
N-channel TrenchMOS standard level FET
6.
Characteristics
Table 6.
Symbol
Static characteristics
V
(BR)DSS
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
I
D
= 250 μA; V
GS
= 0 V; T
j
= 25 °C
I
D
= 250 μA; V
GS
= 0 V; T
j
= -55 °C
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 25 °C; see
Figure 10
; see
Figure 11
I
D
= 1 mA; V
DS
= V
GS
; T
j
= -55 °C; see
Figure 10
; see
Figure 11
I
D
= 1 mA; V
DS
= V
GS
; T
j
= 175 °C; see
Figure 10
; see
Figure 11
V
DS
= 40 V; V
GS
= 0 V; T
j
= 25 °C
V
DS
= 0 V; V
GS
= 20 V; T
j
= 25 °C
V
DS
= 0 V; V
GS
= -20 V; T
j
= 25 °C
V
GS
= 10 V; I
D
= 25 A; T
j
= 175 °C; see
Figure 12
; see
Figure 13
V
GS
= 10 V; I
D
= 25 A; T
j
= 25 °C; see
Figure 12
; see
Figure 13
V
DS
= 40 V; V
GS
= 0 V; T
j
= 175 °C
40
36
2
-
-
3
-
-
4
V
V
V
V
GS(th)
gate-source threshold
voltage
gate-source threshold
voltage
V
GSth
-
-
4.4
V
1
-
-
V
I
DSS
I
GSS
drain leakage current
gate leakage current
-
-
-
-
0.02
2
2
-
1
100
100
4.26
μA
nA
nA
m
R
DSon
drain-source on-state
resistance
-
1.96
2.3
m
I
DSS
Dynamic characteristics
Q
G(tot)
total gate charge
Q
GS
gate-source charge
Q
GD
gate-drain charge
V
GS(pl)
gate-source plateau
voltage
C
iss
input capacitance
C
oss
output capacitance
C
rss
reverse transfer
capacitance
t
d(on)
turn-on delay time
t
r
rise time
t
d(off)
turn-off delay time
t
f
fall time
L
D
internal drain
inductance
drain leakage current
-
-
500
μA
I
D
= 25 A; V
DS
= 32 V; V
GS
= 10 V; see
Figure 15
-
-
-
-
175
49
67
5
-
-
-
-
nC
nC
nC
V
I
D
= 25 A; V
DS
= 32 V; see
Figure 15
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz;
T
j
= 25 °C; see
Figure 16
-
-
-
8492
1606
1101
11323
1927
1508
pF
pF
pF
V
DS
= 30 V; R
L
= 1.2
; V
GS
= 10 V;
R
G(ext)
= 10
-
-
-
-
-
65
133
146
119
4.5
-
-
-
-
-
ns
ns
ns
ns
nH
from drain lead 6 mm from package to
centre of die
from contact screw on mounting base to
centre of die
from source lead to source bonding pad
-
3.5
-
nH
L
S
internal source
inductance
-
7.5
-
nH
Source-drain diode
V
SD
source-drain voltage
I
S
= 25 A; V
GS
= 0 V; T
j
= 25 °C; see
Figure 14
I
S
= 20 A; dI
S
/dt = -100 A/μs; V
GS
= 0 V;
V
DS
= 30 V
-
0.85
1.2
V
t
rr
Q
r
reverse recovery time
recovered charge
-
-
75
57
-
-
ns
nC
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