- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄223348 > AMIS-30623AAGA (ON SEMICONDUCTOR) STEPPER MOTOR CONTROLLER, 0.8 A, PDSO20 PDF資料下載
參數(shù)資料
| 型號： | AMIS-30623AAGA |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 運動控制電子 |
| 英文描述： | STEPPER MOTOR CONTROLLER, 0.8 A, PDSO20 |
| 封裝： | SOIC-20 |
| 文件頁數(shù)： | 63/67頁 |
| 文件大?。?/td> | 2400K |
| 代理商： | AMIS-30623AAGA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁當(dāng)前第63頁第64頁第65頁第66頁第67頁
AMIS-30623 LIN Microstepping Motordriver
Data Sheet
20.0 Soldering
20.
ace Mount Packages
1 Introduction to Soldering Surf
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
ndbook IC26; Integrated Circuit Packa
Ha
ges” (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount
it boar
ICs, or for printed-circu
ds with high population densities. In these situations reflow soldering is often used.
20.2 Re
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
flowing; for
xample, infrared/convection heating in a conveyor type oven.
s (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
mperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept
ve Soldering
soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
omponent density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave
oldering method was specifically developed.
wave soldering is used the following conditions must be observed for optimal results:
ldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar
n two sides and a pitch (e):
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
d-circuit board;
7mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit
int must incor
e downstream end.
For pack
four sides,
ced at a 45 angle to the transport direction of the printed-
circuit bo
ust incorpor
s downstream and at the side corners.
uring placement and before soldering, the pack ge must be fixed with a droplet of adhesive. The adhesive can be applied by screen
inting, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
ypical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most
pplications.
0.4 Manual Soldering
ix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
art of the lead. Contact time must be limited to 10 seconds at up to 300°C.
hen using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 39: Soldering Process
-flow Soldering
board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re
e
Throughput time
Typical re-flow peak te
below 230°C.
20.3 Wa
Conventional single wave
c
s
If
Use a double-wave so
wave.
For packages with leads o
the printe
o
Smaller than 1.2
otpr
board. The fo
porate solder thieves at th
ust be pla
ages with leads on
rint m
the footprint m
ve
ard. The footp
ate solder thie
D
a
pr
T
a
2
F
p
W
Soldering Method
Package
Wave
Reflow(1)
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
Not suitable (2)
Suitable
PLCC (3) , SO, SOJ
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
66
AMI Semiconductor
– June 2006, Rev 3.0
www.amis.com
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMC-2008 | 0 MHz - 50000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 2.3 dB INSERTION LOSS |
| AMR2803R3S/EM | 1-OUTPUT 25 W DC-DC REG PWR SUPPLY MODULE |
| AMR2803R3S/EMPBF | 1-OUTPUT 25 W DC-DC REG PWR SUPPLY MODULE |
| AMR2815S/EM | 1-OUTPUT 30 W DC-DC REG PWR SUPPLY MODULE |
| AN1458S | DUAL OP-AMP, 4000 uV OFFSET-MAX, PDSO8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS-30623AANA | 制造商:AMI 制造商全稱:AMI 功能描述:LIN Microstepping Motordriver |
| AMIS-30623BAGA | 制造商:AMI 制造商全稱:AMI 功能描述:LIN Microstepping Motordriver |
| AMIS-30623BANA | 制造商:AMI 制造商全稱:AMI 功能描述:LIN Microstepping Motordriver |
| AMIS30623C6238G | 功能描述:馬達/運動/點火控制器和驅(qū)動器 LIN STEPPER DRIVER STALL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| AMIS30623C6238RG | 功能描述:馬達/運動/點火控制器和驅(qū)動器 LIN STEPPER DRIVER STALL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。