參數(shù)資料
型號: AM70PDL127CDH
廠商: Advanced Micro Devices, Inc.
英文描述: 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS
中文描述: 2 × 64兆位(8米× 16位)的CMOS 3.0伏特,只有頁面模式閃存數(shù)據(jù)存儲128兆位(8米× 16位)的CMOS
文件頁數(shù): 3/127頁
文件大?。?/td> 849K
代理商: AM70PDL127CDH
ADVANCE INFORMATION
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Refer to AMD’s Website (www.amd.com) for the latest information.
Publication#
30651
Issue Date:
November 24, 2003
Rev:
A
Amendment
+2
Am70PDL127CDH/Am70PDL129CDH
Stacked Multi-Chip Package (MCP/XIP) Flash Memory,
Data storage MirrorBit Flash, and pSRAM (XIP)
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage
128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and
64 Mbit (4 M x 16-Bit) CMOS Pseudo Static RAM
DISTINCTIVE CHARACTERISTICS
MCP Features
Consists of Am29PDL127H/Am29PDL129H, 64 Mb
pSRAM and two Am29LV640M.
Power supply voltage of 2.7 to 3.1 volt
High performance (XIP)
— Access time as fast as 65 ns initial / 25 ns page
High performance (Data Storage)
— Access time as fast as 110 ns initial / 30 ns page
Package
— 93-Ball FBGA
Operating Temperature
— –40°C to +85°C
Flash Memory Features (XIP)
AM29PDL127H/AM29PDL129H
ARCHITECTURAL ADVANTAGES
128 Mbit Page Mode device
— Page size of 8 words: Fast page read access from random
locations within the page
Dual Chip Enable inputs (PDL129 only)
— Two CE# inputs control selection of each half of the memory
space
Single power supply operation
— Full Voltage range: 2.7 to 3.1 volt read, erase, and program
operations for battery-powered applications
Simultaneous Read/Write Operation
— Data can be continuously read from one bank while
executing erase/program functions in another bank
— Zero latency switching from write to read operations
FlexBank Architecture
— 4 separate banks, with up to two simultaneous operations
per device
PDL127:
— Bank A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank B: 48 Mbit (32 Kw x 96)
— Bank C: 48 Mbit (32 Kw x 96)
— Bank D: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
PDL129:
— Bank 1A: 48 Mbit (32 Kw x 96)
— Bank 1B: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank 2A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank 2B: 48 Mbit (32 Kw x 96)
SecSi
TM
(Secured Silicon) Sector region
— Up to 128 words accessible through a command sequence
— Up to 64 factory-locked words
— Up to 64 customer-lockable words
Both top and bottom boot blocks in one device
Manufactured on 0.13 μm process technology
20-year data retention at 125°C
Minimum 1 million erase cycle guarantee per sector
PERFORMANCE CHARACTERISTICS
High Performance
— Page access times as fast as 25 ns
— Random access times as fast as 65 ns
Power consumption (typical values at 10 MHz)
— 45 mA active read current
— 25 mA program/erase current
— 1 μA typical standby mode current
SOFTWARE FEATURES
Software command-set compatible with JEDEC 42.4
standard
— Backward compatible with Am29F and Am29LV families
CFI (Common Flash Interface) complaint
— Provides device-specific information to the system, allowing
host software to easily reconfigure for different Flash devices
Erase Suspend / Erase Resume
— Suspends an erase operation to allow read or program
operations in other sectors of same bank
Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting program or erase
cycle completion
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading array data
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