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參數(shù)資料
| 型號(hào)： | AM29BDS640GTD4WSI |
| 廠商： | SPANSION LLC |
| 元件分類： | DRAM |
| 英文描述： | 64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory |
| 中文描述： | 4M X 16 FLASH 1.8V PROM, 14 ns, PBGA80 |
| 封裝： | 11 X 12 MM, 0.80 MM PITCH, FBGA-80 |
| 文件頁(yè)數(shù)： | 60/65頁(yè) |
| 文件大?。?/td> | 899K |
| 代理商： | AM29BDS640GTD4WSI |
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62
Am29BDS640G
October 31, 2002
AD V A NCE
INF O R M A T IO N
PHYSICAL DIMENSIONS
FBE080—80-ball Fine-Pitch Ball Grid Array (FBGA)
11 x 12 mm Package
Note: BSC is an ANSI standard for Basic Space Centering
D
A
A2
eD
D1
E1
SE
SD
eE
0.20 (4X)
A1 CORNER INDEX MARK
A1 CORNER
A1
SEATING PLANE
10
6
7
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
E
B
Z
0.08
Z
0.25
Z
ZA B
φ0.08
φ0.15
M
NXOb
A
B
C
D
E
F
G
H
J
K
L
M
7
6
5
4
3
2
1
8
A3-A6, B3-B6,
L3-L6, M3-M6
N/A
10.95 mm x 11.95 mm
PACKAGE
FBE 080
NOM.
---
1.20
---
0.94
MAX.
10.95 BSC.
11.95 BSC.
12
---
MIN.
0.84
0.20
8.80 BSC.
5.60 BSC.
8
80
0.30
0.35
0.40 BSC.
E
0.25
0.80 BSC.
ME
D
JEDEC
PACKAGE
SYMBOL
A
A2
A1
MD
D1
E
E1
b
N
NOTE
PACKAGE OUTLINE TYPE
ROW MATRIX SIZE E DIRECTION
BALL FOOTPRINT
BALL PITCH
SOLDER BALL PLACEMENT
BODY SIZE
BALL HEIGHT
BODY SIZE
BODY THICKNESS
OVERALL THICKNESS
BALL DIAMETER
ROW MATRIX SIZE D DIRECTION
TOTAL BALL COUNT
BALL FOOTPRINT
DEPOPULATED SOLDER BALLS
e
SD / SE
3150\38.9G
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" IN THE PACKAGE DRAWING INDICATES THE THEORETICAL
CENTER OF DEPOPULATED BALLS.
9
FOR PACKAGE THICKNESS, "A" IS THE CONTROLLING DIMENSION.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, INK MARK,
METALLIZED MARKINGS INDENTION OR OTHER MEANS.
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