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參數(shù)資料
| 型號(hào)： | ADV7129KS |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 顯示控制器 |
| 英文描述： | 192-Bit, 360 MHz True-Color Video DAC with Onboard PLL |
| 中文描述： | 2000 X 2000 PIXELS PALETTE-DAC DSPL CTLR, PQFP304 |
| 封裝： | PLASTIC, QFP-304 |
| 文件頁數(shù)： | 17/20頁 |
| 文件大小： | 389K |
| 代理商： | ADV7129KS |
ADV7129
–17–
REV. 0
APPENDIX II
THERMAL AND ENVIRONMENTAL CONSIDERATIONS
The ADV7129 is a very highly integrated monolithic silicon
device. This high level of integration inevitably leads to consid-
eration of thermal and environmental conditions which the
ADV7129 must operate in. Reliability of the device is enhanced
by keeping it as cool as possible. In order to avoid destructive
damage to the device, the absolute maximum junction tempera-
ture must never be exceeded. Certain applications, depending
on ambient temperature and pixel data rates may require forced
air cooling or external heatsinks. The following data is intended as
a guide in evaluating the operating conditions of a particular appli-
cation so that optimum device and system performance is achieved.
It should be noted that information on package characteristics
published herein may not be the most up to date at the time of
reading this. Advances in package compounds and manufacture
will inevitably lead to improvements in the thermal data. Please
contact your local sales office for the most up-to-date information.
Package Characteristics
Junction-to-Case (
θ
JC
) Thermal Resistance for this particular
part is:
θ
JC
= 8.9
°
C/W
(
Note:
θ
JC
is independent of airflow.)
The maximum silicon junction temperature should be limited to
100
°
C. Temperatures greater than this will reduce long-term
device reliability. To ensure that the silicon junction tempera-
ture stays within prescribed limits, the addition of an external
heatsink can be used if the junction temperature is brought be-
yond the maximum limit.
Junction-to-Ambient (
θ
JA
) Thermal Resistance for this particu-
lar part is:
θ
JA
= 25.9
°
C/W (Still Air)
θ
JA
= will significantly decrease in air flow.
Thermal Model
The junction temperature of the device in a specific application
is given by:
T
J
=
T
A
+
P
D
(
θ
JC
+
θ
CA
)
or
T
J
=
T
A
+
P
D
(
θ
JA
)
where:
T
J
=
Junction Temperature of Silicon (
°
C)
T
A
=
Ambient Temperature (
°
C)
P
D
=
Power Dissipation (W)
θ
JC
=
Junction to Case Thermal Resistance (
°
C/W)
θ
CA
=
Case to Ambient Thermal Resistance (
°
C/W)
θ
JA
=
Junction to Ambient Thermal Resistance (
°
C/W)
(1)
(2)
SPEED – MHz
160
C
200
240
280
320
360
550
500
475
450
425
525
V
AA
= +5V
Figure 13. Supply Current vs. Frequency
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