參數(shù)資料
型號: ADN2850BCPZ25-RL7
廠商: Analog Devices Inc
文件頁數(shù): 18/28頁
文件大?。?/td> 0K
描述: IC DGTL RHEO DL 25K 9BIT16LFCSP
產(chǎn)品變化通告: Metal Edit Change 03/Feb/2012
標(biāo)準(zhǔn)包裝: 1,500
接片: 1024
電阻(歐姆): 25k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 35 ppm/°C
存儲器類型: 非易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 3 V ~ 5.5 V,±2.25 V ~ 2.75 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 16-LFCSP
包裝: 帶卷 (TR)
Data Sheet
ADN2850
Rev. E | Page 25 of 28
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGC
05-
09-
2012-
A
1
0.80
BSC
PIN 1
INDICATOR
2.40 REF
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.35
0.30
0.25
0.05 MAX
0.02 NOM
0.20 REF
3.25
3.10 SQ
2.95
16
5
13
8
9
12
4
0.60 MAX
PIN 1
INDICATOR
5.10
5.00 SQ
4.90
4.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.25 MIN
BOTTOM VIEW
Figure 44. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 × 5 mm Body, Very Thin Quad
(CP-16-6)
Dimensions shown in millimeters
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 45. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
RWB (k)
Temperature Range
Package Description
Package Option
ADN2850BRUZ25
25
40°C to +85°C
16-Lead TSSOP
RU-16
ADN2850BRUZ25-RL7
25
40°C to +85°C
16-Lead TSSOP
RU-16
ADN2850BCPZ25
25
40°C to +85°C
16-Lead LFCSP_VQ
CP-16-6
ADN2850BCPZ25-RL7
25
40°C to +85°C
16-Lead LFCSP_VQ
CP-16-6
ADN2850BCPZ250
250
40°C to +85°C
16-Lead LFCSP_VQ
CP-16-6
ADN2850BCPZ250-RL7
250
40°C to +85°C
16-Lead LFCSP_VQ
CP-16-6
EVAL-ADN2850SDZ
Evaluation Board
1
Z = RoHS Compliant Part.
2
The evaluation board is shipped with the 25 k RWB resistor option; however, the board is compatible with all available resistor value options.
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