參數(shù)資料
型號: ADAU1761BCPZ
廠商: Analog Devices Inc
文件頁數(shù): 39/92頁
文件大小: 0K
描述: IC SIGMADSP CODEC PLL 32LFCSP
設(shè)計資源: Stereo Digital Microphone Input Using ADAU1761 and ADMP421 (CN0078)
標(biāo)準(zhǔn)包裝: 1
系列: SigmaDSP®
類型: 音頻編解碼器
數(shù)據(jù)接口: 串行
分辨率(位): 24 b
ADC / DAC 數(shù)量: 2 / 2
三角積分調(diào)變:
電壓 - 電源,模擬: 1.8 V ~ 3.65 V
電壓 - 電源,數(shù)字: 1.63V ~ 3.65V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ
包裝: 托盤
產(chǎn)品目錄頁面: 776 (CN2011-ZH PDF)
配用: EVAL-ADAU1761Z-ND - BOARD EVAL FOR ADAU1761
ADAU1761
Rev. C | Page 44 of 92
APPLICATIONS INFORMATION
POWER SUPPLY BYPASS CAPACITORS
Each analog and digital power supply pin should be bypassed to
its nearest appropriate ground pin with a single 100 nF capaci-
tor. The connections to each side of the capacitor should be as
short as possible, and the trace should stay on a single layer with
no vias. For maximum effectiveness, locate the capacitor equi-
distant from the power and ground pins or, when equidistant
placement is not possible, slightly closer to the power pin.
Thermal connections to the ground planes should be made
on the far side of the capacitor.
Each supply signal on the board should also be bypassed with a
single bulk capacitor (10 μF to 47 μF).
VDD
GND
TO GND
TO VDD
CAPACITOR
07
68
0-
0
48
Figure 63. Recommended Power Supply Bypass Capacitor Layout
GSM NOISE FILTER
In mobile phone applications, excessive 217 Hz GSM noise on
the analog supply pins can degrade the audio quality. To avoid
this problem, it is recommended that an L-C filter be used in
series with the bypass capacitors for the AVDD pins. This filter
should consist of a 1.2 nH inductor and a 9.1 pF capacitor in
series between AVDD and ground, as shown in Figure 64.
AVDD
0.1F
9.1pF
1.2nH
10F
+
0
76
80
-0
49
Figure 64. GSM Filter on the Analog Supply Pins
GROUNDING
A single ground plane should be used in the application layout.
Components in an analog signal path should be placed away
from digital signals.
EXPOSED PAD PCB DESIGN
The ADAU1761 has an exposed pad on the underside of the
LFCSP. This pad is used to couple the package to the PCB for
heat dissipation when using the outputs to drive earpiece or
headphone loads. When designing a board for the ADAU1761,
special consideration should be given to the following:
A copper layer equal in size to the exposed pad should be
on all layers of the board, from top to bottom, and should
connect somewhere to a dedicated copper board layer (see
Vias should be placed to connect all layers of copper,
allowing for efficient heat and energy conductivity. For an
example, see Figure 66, which has nine vias arranged in a
3 inch × 3 inch grid in the pad area.
TOP
POWER
GROUND
BOTTOM
COPPER SQUARES
VIAS
0
76
80
-0
50
Figure 65. Exposed Pad Layout Example, Side View
07
68
0-
0
51
Figure 66. Exposed Pad Layout Example, Top View
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