參數(shù)資料
型號： AD9779ABSVZRL
廠商： Analog Devices Inc
文件頁數(shù)： 56/56頁
文件大小： 0K
描述： DAC 16BIT 1.0GSPS 100-TQFP
產(chǎn)品培訓模塊： Data Converter Fundamentals
DAC Architectures
設計資源： Interfacing ADL5370 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0016)
Interfacing ADL5371 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0017)
Interfacing ADL5372 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0018)
Interfacing ADL5373 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0019)
Interfacing ADL5374 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0020)
Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021)
標準包裝： 1,000
位數(shù)： 16
數(shù)據(jù)接口： 串行
轉換器數(shù)目： 2
電壓電源： 模擬和數(shù)字
功率耗散（最大）： 300mW
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 100-TQFP 裸露焊盤
供應商設備封裝： 100-TQFP-EP（14x14）
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 4 電流，單極
采樣率（每秒）： 1G
AD9776A/AD9778A/AD9779A
Rev. B | Page 9 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With Respect To
Rating
AVDD33, DVDD33
AGND, DGND,
CGND
0.3 V to +3.6 V
DVDD18, CVDD18
AGND, DGND,
CGND
0.3 V to +2.1 V
AGND
DGND, CGND
0.3 V to +0.3 V
DGND
AGND, CGND
0.3 V to +0.3 V
CGND
AGND, DGND
0.3 V to +0.3 V
I120, VREF, IPTAT
AGND
0.3 V to
AVDD33 + 0.3 V
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
AGND
1.0 V to
AVDD33 + 0.3 V
P1D[15:0], P2D[15:0]
DGND
0.3 V to
DVDD33 + 0.3 V
DATACLK, TXENABLE
DGND
0.3 V to
DVDD33 + 0.3 V
REFCLK+, REFCLK
CGND
0.3 V to
CVDD18 + 0.3 V
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O,
SYNC_I+, SYNC_I,
CSB, SCLK, SDIO, SDO
DGND
0.3 V to
DVDD33 + 0.3 V
Junction Temperature
+125°C
Storage Temperature
Range
65°C to +150°C
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA.
Table 6. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
100-Lead TQFP
EPAD Soldered
19.1
12.4
7.1
°C/W
EPAD Not Soldered
27.4
°C/W
ESD CAUTION
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相關代理商/技術參數(shù)
參數(shù)描述
AD9779A-DPG2-EBZ 功能描述:BOARD EVALUATION FOR AD9779A RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 數(shù)模轉換器 (DAC) 系列:* 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- DAC 的數(shù)量:4 位數(shù):12 采樣率（每秒）:- 數(shù)據(jù)接口:串行，SPI? 設置時間:3µs DAC 型:電流/電壓 工作溫度:-40°C ~ 85°C 已供物品:板 已用 IC / 零件:MAX5581
AD9779A-EBZ 制造商:Analog Devices 功能描述:DUAL 16B, 1.0 GSPS TXDAC - Bulk
AD9779AMOD-EBZ 制造商:Analog Devices 功能描述:DUAL 16B, 1.0 GSPS TXDAC - Bulk
AD9779AXSVZ 制造商:Analog Devices 功能描述:DUAL 16-BIT, 1 GSPS, DIGITAL-TO-ANALOG CONVERTER - Bulk
AD9779BSV 制造商:Analog Devices 功能描述:DAC 2CH INTERPOLATION FLTR 16BIT 100TQFP EP - Bulk
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