參數(shù)資料
型號(hào): 71V67703S75BQ
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: SRAM
英文描述: 256K X 36 CACHE SRAM, 7.5 ns, PBGA165
封裝: 13 X 15 MM, 1.2 MM HEIGHT, 1 MM PITCH, FBGA-165
文件頁(yè)數(shù): 11/23頁(yè)
文件大?。?/td> 515K
代理商: 71V67703S75BQ
6.42
19
IDT71V67703, IDT71V67903, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
3.3V I/O, Flow-Through Outputs, Single Cycle Deselect
Commercial and Industrial Temperature Ranges
100-Pin Thin Plastic Quad Flatpack (TQFP) Package Diagram Outline
相關(guān)PDF資料
PDF描述
72-30-33 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-40-43 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-10-14 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-30-13 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72013-8007LF 24 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
71V67703S75BQ8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 165-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC SGL 3.3V 9MBIT 256KX36 7.5NS 165FBGA - Tape and Reel
71V67703S75BQG 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V67703S75BQG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 165-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC SGL 3.3V 9MBIT 256KX36 7.5NS 165FBGA - Tape and Reel
71V67703S75BQGI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V67703S75BQGI8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 165-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC SGL 3.3V 9MBIT 256KX36 7.5NS 165FBGA - Tape and Reel