參數(shù)資料
型號: 38C1
廠商: Mitsubishi Electric Corporation
英文描述: DIODE ZENER SINGLE 200mW 24Vz 0.05mA-Izt 0.05 0.05uA-Ir 18.2 SOD-323 3K/REEL
中文描述: 單芯片8位CMOS微機
文件頁數(shù): 56/59頁
文件大小: 1063K
代理商: 38C1
56
38C1 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
MITSUBISHI MICROCOMPUTERS
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
PACKAGE OUTLINE
64P6U-A
LQFP64-P-1010-0.50
Weight(g)
JEDEC Code
EIAJ Package Code
Lead Material
Cu Alloy
64P6Q-A
Plastic 64pin 10
10mm body LQFP
M
D
0.1
1.4
0.2
0
°
Symbol
Min
Nom
Max
1.7
A
A
1
A
2
b
c
D
E
e
H
E
L
L
1
Lp
A3
y
b
2
I
2
M
D
M
E
Dimension in Millimeters
H
D
0.225
10.4
10.4
1.0
10
°
0.1
1.0
0.6
0.25
0.7
0.5
0.3
12.2
12.0
11.8
12.2
12.0
11.8
0.5
10.1
10.0
9.9
10.1
10.0
9.9
0.175
0.125
0.105
0.28
0.18
0.13
0
e
E
H
E
1
64
49
48
33
32
17
16
H
D
D
M
E
A
F
y
b
2
I
2
Recommended Mount Pad
0.45
0.75
0.08
x
b
x
M
A
1
A
2
L
1
L
Detail F
Lp
A
c
e
MMP
LQFP64-P-1414-0.8
Weight(g)
JEDEC Code
EIAJ Package Code
Lead Material
Cu Alloy
Plastic 64pin 14
14mm body LQFP
0.1
1.4
0.8
16.0
16.0
0.2
0
°
Symbol
Min
Nom
Max
1.7
A
A
1
A
2
b
c
D
E
e
H
E
L
L
1
Lp
A3
y
b
2
I
2
M
D
M
E
Dimension in Millimeters
H
D
0.225
14.4
14.4
8
°
0.1
0.2
1.0
0.6
0.25
0.7
0.5
0.3
16.2
16.2
15.8
15.8
14.1
14.1
13.9
13.9
14.0
14.0
0.175
0.125
0.105
0.45
0.37
0.32
0
0.45
0.95
0.75
x
Recommended Mount Pad
Detail F
MMP
E
H
E
1
17
32
64
49
16
48
33
H
D
D
A
y
b
x
M
e
F
M
D
l
2
b
2
M
E
e
A
1
A
2
L
1
L
Lp
A
c
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