參數(shù)資料
型號: 21084
英文描述: AMD-K6 Processor Bios Design Application Note AMD-K6 Processor I/O Model Application Note
中文描述: 的AMD - K6處理器的BIOS設(shè)計中的應(yīng)用注意的AMD - K6處理器的I / O模型的應(yīng)用說明
文件頁數(shù): 8/14頁
文件大小: 357K
代理商: 21084
4
IBIS Modeling
AMD-K6
Processor I/O Model
21084D/0—June 1999
I
T
propmax
is the maximum propagation delay of the signal
along the PCB trace from its source to its destination. This
delay is obtained by simulating with the worst-case
conditions.
T
setupmin
is the minimum required setup time of a signal at
its destination
I
Figure 2. Timing Considerations for Meeting Setup Time
To ensure the setup time of a signal is met, the following
relationship must be met:
T
validmax
+ T
propmax
+ T
setupmin
< T
period
– T
skew
– T
jitter
Signal at Destination
Signal at Source
Clocks
T
period
T
skew
T
validmax
T
propmax
T
setupmin
相關(guān)PDF資料
PDF描述
21085 AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note
21086 SYSCALL and SYSRET Instruction Specification? 341KB (PDF)
2108I ALARMMODUL
210A200 Synchro/Resolver Reference Oscillator
210A200B Synchro/Resolver Reference Oscillator
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
2108-4-00-00-00-00-07-0 功能描述:電路板硬件 - PCB SWAGE MNT SOLDER TERMINALS RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
2108-4-00-01-00-00-07-0 功能描述:電路板硬件 - PCB 200u SN/PB OVER NI RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
2108-4-00-44-00-00-07-0 功能描述:電路板硬件 - PCB 300u AG OVER CU RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
2108-4-00-50-00-00-07-0 功能描述:電路板硬件 - PCB 300u ELECTRO-SOLDER RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin
2108-4-00-80-00-00-07-0 功能描述:電路板硬件 - PCB 200u SN OVER NI RoHS:否 制造商:Harwin 類型:Shield Clip 長度:9.4 mm 螺紋大小: 外徑: 材料:Beryllium Copper 電鍍:Tin