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參數(shù)資料
| 型號(hào)： | 21084 |
| 英文描述： | AMD-K6 Processor Bios Design Application Note AMD-K6 Processor I/O Model Application Note |
| 中文描述： | 的AMD - K6處理器的BIOS設(shè)計(jì)中的應(yīng)用注意的AMD - K6處理器的I / O模型的應(yīng)用說明 |
| 文件頁數(shù)： | 14/14頁 |
| 文件大小： | 357K |
| 代理商： | 21084 |
10
IBIS Modeling
AMD-K6
Processor I/O Model
21084D/0—June 1999
I
Pin Mapping
—Specifies the power and ground buses to
which a driver is connected. This is important when
modeling ground bounce or simultaneous switching noise.
Driver Schedule
—Specifies the switching sequence and time
for referenced sub-models to produce a multi-stage driver.
Define Package Model
—Specifies the start of a package
model description.
Number of Sections
—Specifies the number of sections that
make up the connection between the die pad and the
corresponding package pin. It may include the C4 bump, the
connection between the bump pad and pin, and the pin
itself.
Number of Pins
—Specifies to the IBIS parser the number of
pins in the model.
Pin Numbers
—Specifies the names for the package pins and
also defines pin ordering. If the
Number of Sections
keyword
is used,
Pin Numbers
also list the elements for each section
of the die to pin connection.
End Package Model
—Indicates the end of a package model
description.
I
I
I
I
I
I
IBIS Models
AMD has developed I/O buffer models that represent the
characteristics of the AMD-K6 processor family. The model files
are specific to particular models of the AMD-K6 processor. Each
model file contains a Standard I/O Model (K6STD) and a strong
I/O Model (K6STG), and these models are assigned to their
respective I/O pins. The description contained in each file
specifies the AMD-K6 processor’s model and stepping to which
the model is applicable.
I/O Model
The IBIS Model files are available from the AMD web site at
http://www.amd.com
.
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