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參數(shù)資料
| 型號(hào)： | 21084 |
| 英文描述： | AMD-K6 Processor Bios Design Application Note AMD-K6 Processor I/O Model Application Note |
| 中文描述： | 的AMD - K6處理器的BIOS設(shè)計(jì)中的應(yīng)用注意的AMD - K6處理器的I / O模型的應(yīng)用說明 |
| 文件頁數(shù)： | 13/14頁 |
| 文件大?。?/td> | 357K |
| 代理商： | 21084 |
IBIS Modeling
9
21084D/0—June 1999
AMD-K6
Processor I/O Model
have R/L/C values specified. C_comp specifies the
capacitance of the silicon die.
Model
(model_type, Vinl, Vinh, Vmeas, Cref, Rref, Vref)—
Specifies the type of I/O buffer. K6STD and K6STG are the
two buffers defined for the AMD-K6 processor. K6STD
represents the standard strength driver and K6STG
represents the strong strength driver.
The model_type of both K6STD and K6STG is I/O, Vinl
equals 0.8V, Vinh equals 2.0V, and Vmeas = 1.5V. Cref,
Rref, and Vref, which represent the test load under which
the specified propagation delays and switching times are
defined. Rref =
∞
; Cref and Vref = 0.
Temperature Range
—Specifies the temperature range within
which the operation of the component is guaranteed.
Voltage Range
—Specifies the I/O voltage range.
Pulldown
—Specifies the voltage versus current (V/I) curves
of the pulldown device within the I/O buffer.
Pullup
—Specifies the V/I curves of the pullup device within
the I/O buffer.
GND Clamp
—Specifies the V/I curves of the ground clamp
device within the I/O buffer.
POWER Clamp
—Specifies the V/I curves of the power clamp
device within the I/O buffer.
Ramp
(dV/dt_r, dV/dt_f, R_load)—Specifies the rise and fall
times of a signal at a load defined by R_load. R_load is equal
to 50 ohms.
Rising Waveform
—Specifies the voltage versus time (V/T)
curves of the rising edge of the waveform.
Falling Waveform
—Specifies the V/T curves of the falling
edge of the waveform.
I
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I
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In addition to the keywords above, IBIS 3.x allows modeling
drivers with multi-V/I characteristics and more detailed
package modeling. Because the AMD-K6 processor family has
multi-V/I drivers, it is recommended to use simulators that
support the IBIS 3.x standard.
I
Package Model
—Specifies the package model name. The
package model may be contained in the same file or it can be
a separate file.
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