參數(shù)資料
型號: XCS30-3BG256C
廠商: Xilinx Inc
文件頁數(shù): 81/83頁
文件大?。?/td> 0K
描述: IC FPGA 5V C-TEMP 256-PBGA
標準包裝: 40
系列: Spartan®
LAB/CLB數(shù): 576
邏輯元件/單元數(shù): 1368
RAM 位總計: 18432
輸入/輸出數(shù): 192
門數(shù): 30000
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BBGA
供應商設備封裝: 256-PBGA
Spartan and Spartan-XL FPGA Families Data Sheet
82
DS060 (v2.0) March 1, 2013
Product Specification
R
Product Obsolete/Under Obsolescence
Ordering Information
Table 20: User I/O Chart for Spartan/XL FPGAs
Device
Max
I/O
Package Type
PC84(1)
VQ100(1)
CS144(1)
TQ144
PQ208
PQ240
BG256(1)
CS280(1)
XCS05
80
61(1)
77
------
XCS10
112
61(1)
77
-
112
----
XCS20
160
-
77
-
113
160
-
XCS30
192
-
77(1)
-
113
169
192
192(1)
-
XCS40
224
----
169
192
205
-
XCS05XL
80
61(1)
77(2)
------
XCS10XL
112
61(1)
77(2)
112(1)
112(2)
----
XCS20XL
160
-
77(2)
113(1)
113(2)
160(2)
---
XCS30XL
192
-
77(2)
-113(2)
169(2)
192(2)
192(1)
XCS40XL
224
----
169(2)
192(2)
205(2)
224(1)
6/25/08
Notes:
1.
PC84, CS144, and CS280 packages, and VQ100 and BG256 packages for XCS30 only, discontinued by PDN2004-01
2.
These Spartan-XL devices are available in Pb-free package options. The Pb-free packages insert a "G" in the package code. Contact
Xilinx for availability.
XCS20XL-4 PQ208C
Example:
Temperature Range
C = Commercial (TJ = 0° to +85°C)
I = Industrial (TJ = –40°C to +100°C)
Number of Pins
Device Type
Speed Grade
-3
-4
-5
BG = Ball Grid Array
BGG = Ball Grid Array (Pb-free)
PC = Plastic Lead Chip Carrier
PQ = Plastic Quad Flat Pack
PQG = Plastic Quad Flat Pack (Pb-free)
VQ = Very Thin Quad Flat Pack
VQG = Very Thin Quad Flat Pack (Pb-free)
TQ = Thin Quad Flat Pack
TQG = Thin Quad Flat Pack (Pb-free)
CS = Chip Scale
Package Type
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