參數(shù)資料
型號(hào): XC2S600E-6FG456Q
廠商: Xilinx Inc
文件頁(yè)數(shù): 61/108頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-IIE 456FPBGA
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-IIE
LAB/CLB數(shù): 3456
邏輯元件/單元數(shù): 15552
RAM 位總計(jì): 294912
輸入/輸出數(shù): 329
門數(shù): 600000
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
56
DS077-4 (v3.0) August 9, 2013
Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Package Thermal Characteristics
Table 14 provides the thermal characteristics for the various
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
The junction-to-case thermal resistance (
θJC) indicates the
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (
θJB)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (
θJA) value
reports the temperature difference between the ambient
environment and the junction temperature. The
θJA value is
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θJA value in a system without a fan. The thermal resistance
drops with increasing air flow.
Table 14: Spartan-IIE Package Thermal Characteristics
Package
Device
Junction-to-Case
(
θJC)
Junction-to-
Board (
θJB)
Junction-to-Ambient (
θJA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
TQ144
TQG144
XC2S50E
5.8
N/A
32.3
25.1
21.5
20.1
°C/Watt
XC2S100E
5.3
N/A
31.4
24.4
20.8
19.6
°C/Watt
PQ208
PQG208
XC2S50E
7.1
N/A
35.1
25.9
22.9
21.2
°C/Watt
XC2S100E
6.1
N/A
34.2
25.2
22.3
20.7
°C/Watt
XC2S150E
6.0
N/A
34.1
25.2
22.2
20.6
°C/Watt
XC2S200E
4.6
N/A
32.4
23.9
21.2
19.6
°C/Watt
XC2S300E
4.0
N/A
31.6
23.3
20.6
19.1
°C/Watt
FT256
FTG256
XC2S50E
7.3
17.8
27.4
21.6
20.4
20.0
°C/Watt
XC2S100E
5.8
15.1
25.0
19.5
18.2
17.8
°C/Watt
XC2S150E
5.7
14.8
24.8
19.3
18.0
17.6
°C/Watt
XC2S200E
3.9
11.4
21.9
16.6
15.2
14.7
°C/Watt
XC2S300E
3.2
10.1
20.8
15.6
14.2
13.7
°C/Watt
XC2S400E
2.5
8.8
19.7
14.5
13.2
12.6
°C/Watt
FG456
FGG456
XC2S100E
8.4
14.9
24.3
19.2
18.1
17.4
°C/Watt
XC2S150E
8.2
14.6
24.1
19.0
17.9
17.1
°C/Watt
XC2S200E
6.3
11.6
21.0
16.1
15.0
14.3
°C/Watt
XC2S300E
5.6
10.4
19.9
15.1
13.9
13.2
°C/Watt
XC2S400E
3.6
6.5
17.7
11.7
10.5
10.0
°C/Watt
XC2S600E
2.7
5.0
17.3
11.2
10.0
9.5
°C/Watt
FG676
FGG676
XC2S400E
4.1
7.9
15.6
11.1
9.8
9.2
°C/Watt
XC2S600E
3.4
6.9
14.5
9.9
8.6
7.9
°C/Watt
相關(guān)PDF資料
PDF描述
XC2V8000-5FFG1152I IC FPGA VIRTEX-II 8M 1152-FBGA
XC3195A-09PQ160C IC FPGA 7500 GATE 160-PQFP
XC3S1000L-4FGG320C SPARTAN-3A FPGA 1M STD 320-FBGA
XC3S1400A-4FT256I IC FPGA SPARTAN 3 256FTBGA
XC3S1400A-5FGG676C IC SPARTAN-3A FPGA 1400K 676FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S600E-6FG676C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA
XC2S600E-6FG676I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
XC2S600E-6FGG456C 功能描述:IC SPARTAN-IIE FPGA 600K 456FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Spartan®-IIE 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC2S600E-6FGG456I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA
XC2S600E-6FGG676C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-IIE FPGA