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參數(shù)資料
| 型號(hào)： | WEDPNF8M722V-1015BI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA275 |
| 封裝： | 32 X 25 MM, PLASTIC, BGA-275 |
| 文件頁(yè)數(shù)： | 29/43頁(yè) |
| 文件大?。?/td> | 1280K |
| 代理商： | WEDPNF8M722V-1015BI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPNF8M722V-XBX
Notes:
1. FPA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. FD7 is the output of the complement of the data written to each chip.
4. FDOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
FLASH ALTERNATE FCS CONTROLLED PROGRAMMING OPERATION TIMINGS
FIG. 15
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| WEDPNF8M722V-1015BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M722V-1210BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M722V-1210BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M722V-1210BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M722V-1212BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
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