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參數(shù)資料
| 型號： | WEDPN8M64V-133B2C |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 8M X 64 SYNCHRONOUS DRAM, 5.5 ns, PBGA219 |
| 封裝： | 21 X 21 MM, PLASTIC, BGA-219 |
| 文件頁數(shù)： | 14/15頁 |
| 文件大小： | 398K |
| 代理商： | WEDPN8M64V-133B2C |
WEDPN8M64V-XB2X
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
January 2005
Rev. 2
AUTO PRECHARGE ensures that the precharge is initiated
at the earliest valid stage within a burst. The user must
not issue another command to the same bank until the
precharge time (tRP) is completed. This is determined as
if an explicit PRECHARGE command was issued at the
earliest possible time.
BURST TERMINATE
The BURST TERMINATE command is used to truncate
either xed-length or full-page bursts. The most recently
registered READ or WRITE command prior to the BURST
TERMINATE command will be truncated.
AUTO REFRESH
AUTO REFRESH is used during normal operation of
the SDRAM and is analagous to CAS#-BEFORE-RAS#
(CBR) REFRESH in conventional DRAMs. This command
is nonpersistent, so it must be issued each time a refresh
is required. All active banks must be PRECHARGED
prior to issuing an AUTO REFRESH command. The
AUTO REFRESH command should not be issued until
the minimum tRP has been met after the PRECHARGE
command as shown in the operation section.
The addressing is generated by the internal refresh
controller. This makes the address bits “Don’t Care” during
an AUTO REFRESH command. Each 128Mb SDRAM
requires 4,096 AUTO REFRESH cycles every refresh
period (tREF). Providing a distributed AUTO REFRESH
command will meet the refresh requirement and ensure
that each row is refreshed. Alternatively, 4,096 AUTO
REFRESH commands can be issued in a burst at the
minimum cycle rate (tRC), once every refresh period
(tREF).
SELF REFRESH*
The SELF REFRESH command can be used to retain data
in the SDRAM, even if the rest of the system is powered
down. When in the self refresh mode, the SDRAM retains
data without external clocking. The SELF REFRESH
command is initiated like an AUTO REFRESH command
except CKE is disabled (LOW). Once the SELF REFRESH
command is registered, all the inputs to the SDRAM
become “Don’t Care,” with the exception of CKE, which
must remain LOW.
Once self refresh mode is engaged, the SDRAM provides
its own internal clocking, causing it to perform its own AUTO
corresponding I/Os will be High-Z two clocks later; if the
DQM signal was registered LOW, the I/Os will provide
valid data.
WRITE
The WRITE command is used to initiate a burst write
access to an active row. The value on the BA0, BA1 inputs
selects the bank, and the address provided on inputs A0-8
selects the starting column location. The value on input A10
determines whether or not AUTO PRECHARGE is used. If
AUTO PRECHARGE is selected, the row being accessed
will be precharged at the end of the WRITE burst; if AUTO
PRECHARGE is not selected, the row will remain open for
subsequent accesses. Input data appearing on the I/Os is
written to the memory array subject to the DQM input logic
level appearing coincident with the data. If a given DQM
signal is registered LOW, the corresponding data will be
written to memory; if the DQM signal is registered HIGH,
the corresponding data inputs will be ignored, and a WRITE
will not be executed to that byte/column location.
PRECHARGE
The PRECHARGE command is used to deactivate the
open row in a particular bank or the open row in all banks.
The bank(s) will be available for a subsequent row access
a specied time (tRP) after the PRECHARGE command is
issued. Input A10 determines whether one or all banks are
to be precharged, and in the case where only one bank
is to be precharged, inputs BA0, BA1 select the bank.
Otherwise BA0, BA1 are treated as “Don’t Care.” Once a
bank has been precharged, it is in the idle state and must
be activated prior to any READ or WRITE commands being
issued to that bank.
AUTO PRECHARGE
AUTO PRECHARGE is a feature which performs the same
individual-bank PRECHARGE function described above,
without requiring an explicit command. This is accomplished
by using A10 to enable AUTO PRECHARGE in conjunction
with a specic READ or WRITE command. A precharge of
the bank/row that is addressed with the READ or WRITE
command is automatically performed upon completion of
the READ or WRITE burst, except in the full-page burst
mode, where AUTO PRECHARGE does not apply. AUTO
PRECHARGE is nonpersistent in that it is either enabled or
disabled for each individual READ or WRITE command.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPN8M64V-133B2I | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx64 Synchronous DRAM |
| WEDPN8M64V-133B2M | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx64 Synchronous DRAM |
| WEDPN8M64V-133BC | 制造商:Microsemi Corporation 功能描述:8M X 64 SDRAM MODULE, 3.3V, 133 MHZ, 219 PBGA 25MM X 25MM, C - Bulk |
| WEDPN8M64VR-XBX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Registered SDRAM MCP |
| WEDPN8M64V-XB2X | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx64 Synchronous DRAM |
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