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參數(shù)資料
| 型號： | W9751G8JB-18 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | DRAM |
| 英文描述： | DDR DRAM, PBGA84 |
| 封裝： | 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 |
| 文件頁數(shù)： | 5/17頁 |
| 文件大?。?/td> | 1458K |
| 代理商： | W9751G8JB-18 |
13/16
Interfaces
Fig.48 FIN / RIN
Fig.49 VREF
Fig.50 OUT1 / OUT2
Fig.51 OUT1 / OUT2
(SOP8/HRP7)
(SSOPB24/HSOP25/HSOPM28)
NOTES FOR USE
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating.
Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important
to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is
to be implemented.
2) Connecting the power supply connector backward
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply lines, such as adding an external direction diode.
3) Power supply lines
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path
by inserting capacitors across the power supply and GND. In this case, it is important to conclusively confirm that none
of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures
- occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the
regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product,
including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation,
physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and
GND.
4) Electrical potential at GND
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to
determine whether there is any terminal that provides voltage below GND, including the voltage during transient
phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s
reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that
voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the
same way, care must be taken to avoid changes in the GND wire pattern in any external connected component.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error, or if pins are shorted together.
7) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with
electromagnetic fields.
FIN
VCC
RIN
100k
VREF
VCC
10k
OUT1
OUT2
VCC
GND
VCC
OUT1
OUT2
RNF
GND
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