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參數(shù)資料
| 型號(hào)： | W9751G8JB-18 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | DRAM |
| 英文描述： | DDR DRAM, PBGA84 |
| 封裝： | 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 |
| 文件頁數(shù)： | 4/17頁 |
| 文件大小： | 1458K |
| 代理商： | W9751G8JB-18 |
12/16
Thermal design
Fig.43 Thermal derating curve
Fig.44 Thermal derating curve
Fig.45 Thermal derating curve
(SOP8)
(SSOPB24)
(HRP7)
Fig.46 Thermal derating curve
Fig.47 Thermal derating curve
(HSOP25)
(HSOPM28)
Thermal design needs to meet the following operating conditions.
In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below.
1. The ambient temperature Ta must be 85°C or below
2. The junction temperature Tj must be 150°C or below
The junction temperature Tj can be determined using the following equation.
Tj Ta + j-a x Pc [°C]
The power consumption Pc can be determined using the following equation. Refer to page 4 about VON(H) and VF(H).
Pc (IOUT
2 x RON) x (VREF / VCC) + IOUT x (VON(H) + VF(H)) x (1 - VREF / VCC) + VCC x ICC [W]
Example using the BD6232FP
Conditions: Ta=50°C, VCC=VREF=24V, Iout=0.5A.
The power consumption of the IC and the junction temperature are as follows:
Pc 0.5
2 x 1.0 + 24 x 1.3m = 281mW
Tj 50 + 86.2 x 281m = 74 [°C]
Where the Tjmax parameter is 150°C and the derating is set to 80 percents, the maximum ambient temperature
Tamax is determined as follows.
Ta Tjmax x 0.8 - j-a x Pc 96 [°C]
In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design),
since the system meets the operating temperature conditions.
Table 9 Thermal resistance
Package
j-a [°C/W]
SOP8
182
SSOPB24
122
HRP7
89.3
HSOP25
86.2
HSOP28
56.8
Mounted on a 70mmx70mmx1.6mm FR4 glass-epoxy
board with less than 3% copper foil.
0.0
0.5
1.0
1.5
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.562W
ii) 0.687W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0.0
2.0
4.0
6.0
8.0
10.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) Package only (copper foil: 10.5mm x 10.5mm)
ii) 2 layers PCB (copper foil: 15mm x 15mm)
iii) 2 layers PCB (copper foil: :70mm x 70mm)
iv) 4 layers PCB (copper foil: 70mm x 70mm)
i) 1.4W
ii) 2.3W
iii) 5.5W
iv) 7.3W
0
1
2
3
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.85W
ii) 1.45W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0
1
2
3
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 1.80W
ii) 2.20W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0.0
0.5
1.0
1.5
025
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.787W
ii) 0.976W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
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