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參數(shù)資料
| 型號(hào)： | W3H32M72E-667SBC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
| 封裝： | 18 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 24/31頁 |
| 文件大?。?/td> | 873K |
| 代理商： | W3H32M72E-667SBC |
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W3H32M72E-XSBX
30
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
July 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
September 2005
Advanced
Rev 1
Changes (Pg. 1, 3, 6)
1.1 Add pinout
November 2005
Advanced
Rev 2
Changes (Pg. All)
2.1 Change status to Preliminary
2.2 Add additional functional information
February 2006
Preliminary
Rev 3
Changes (Pg. 1, 7, 8, 9, 23, 24, 25, 26, 27, 30)
3.1 Remove redundant Initialization notes
3.2 Update leakage current for clock signals
3.3 Insert ODT values table
3.4 Update ICC2p for all speeds
3.5 Update ICC3p for all speeds
3.6 Update ICC6 for all speeds
3.7 Update tDS for all speeds
3.8 Correct typo on AC Timing Table tQH →tDH
3.9 Update tDH for all speeds
3.10 Correct typo AC Timing Table tHQ →tQH
3.11 Update tDQSCK for all speeds
3.12 Add tOQSS parameter
3.13 Add tREFI for Military temperature
February 2007
Preliminary
Rev 4
Changes (Pg. 1, 24, 25, 26, 27, 29)
4.1 Add 667Mbs data rate information
March 2007
Preliminary
Rev 5
Changes (Pg. 1, 13, 29, 30)
5.1 Change status to nal
5.2 Add thermal resistance data
5.3 Correct typo on pin conguration UMDx to UDMx
September 2007
Final
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3H64M16E-400BC | 64M X 16 DDR DRAM, 0.6 ns, PBGA79 |
| W3H64M64E-400SBC | 64M X 64 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-400ESI | 64M X 72 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-400ESI | 64M X 72 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-533ES | 64M X 72 DDR DRAM, 0.5 ns, PBGA208 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M72E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M72E-667SBM | 制造商:PMG/Microsemi 功能描述: |
| W3H32M72E-ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M72E-ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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