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參數(shù)資料
| 型號： | W3H32M72E-667SB2M |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
| 封裝： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 21/25頁 |
| 文件大?。?/td> | 1062K |
| 代理商： | W3H32M72E-667SB2M |
W3H32M72E-XSB2X
November 2010 2010 Microsemi Corporation. All rights reserved.
5
Microsemi Corporation (602) 437-1520 www.whiteedc.com
Rev. 3
www.microsemi.com
Microsemi Corporation reserves the right to change products or specications without notice.
DESCRIPTION
The 2Gb DDR2 SDRAM is a high-speed CMOS, dynamic random-
access memory containing 2,147,483,648 bits. Each of the ve
chips in the MCP are internally congured as 4-bank DRAM. The
block diagram of the device is shown in Figure 2. Ball assignments
and are shown in Figure 3.
The 2Gb DDR2 SDRAM uses a double-data-rate architecture to
achieve high-speed operation. The double data rate architecture is
essentially a 4n-prefetch architecture, with an interface designed
to transfer two data words per clock cycle at the I/O balls. A single
read or write access for the 2Gb DDR2 SDRAM effectively consists
of a single 4n-bit-wide, one-clock-cycle data transfer at the internal
DRAM core and four corresponding n-bit-wide, one-half-clock-cycle
data transfers at the I/O balls.
A bidirectional data strobe (DQS, DQS#) is transmitted externally,
along with data, for use in data capture at the receiver. DQS is a
strobe transmitted by the DDR2 SDRAM during READs and by
the memory controller during WRITEs. DQS is edge-aligned with
data for READs and center-aligned with data for WRITEs. There
are strobes, one for the lower byte (LDQS, LDQS#) and one for
the upper byte (UDQS, UDQS#).
The 2Gb DDR2 SDRAM operates from a differential clock (CK and
CK#); the crossing of CK going HIGH and CK# going LOW will
be referred to as the positive edge of CK. Commands (address
and control signals) are registered at every positive edge of CK.
Input data is registered on both edges of DQS, and output data is
referenced to both edges of DQS, as well as to both edges of CK.
Read and write accesses to the DDR2 SDRAM are burst oriented;
accesses start at a selected location and continue for a programmed
number of locations in a programmed sequence. Accesses begin
with the registration of an ACTIVE command, which is then followed
by a READ or WRITE command. The address bits registered
coincident with the ACTIVE command are used to select the bank
and row to be accessed. The address bits registered coincident
with the READ or WRITE command are used to select the bank
and the starting column location for the burst access.
The DDR2 SDRAM provides for programmable read or write
burst lengths of four or eight locations. DDR2 SDRAM supports
interrupting a burst read of eight with another read, or a burst
write of eight with another write. An auto precharge function may
be enabled to provide a self-timed row precharge that is initiated
at the end of the burst access.
As with standard DDR SDRAMs, the pipelined, multibank
architecture of DDR2 SDRAMs allows for concurrent operation,
thereby providing high, effective bandwidth by hiding row precharge
and activation time.
A self refresh mode is provided, along with a power-saving power-
down mode.
All inputs are compatible with the JEDEC standard for SSTL_18.
All full drive-strength outputs are SSTL_18-compatible.
GENERAL NOTES
The functionality and the timing specications discussed in this
data sheet are for the DLL-enabled mode of operation.
Throughout the data sheet, the various gures and text refer to
DQs as “DQ.” The DQ term is to be interpreted as any and all
DQ collectively, unless specically stated otherwise. Additionally,
each chip is divided into 2 bytes, the lower byte and upper byte.
For the lower byte (DQ0–DQ7), DM refers to LDM and DQS
refers to LDQS. For the upper byte (DQ8–DQ15), DM refers to
UDM and DQS refers to UDQS. Note that the there is no upper
byte for U4 and therefore no UDM4.
Complete functionality is described throughout the document
and any page or diagram may have been simplied to convey a
topic and may not be inclusive of all requirements.
Any specic requirement takes precedence over a general
statement.
INITIALIZATION
DDR2 SDRAMs must be powered up and initialized in a
predened manner. Operational procedures other than those
specied may result in undened operation. The following
sequence is required for power up and initialization and is
shown in Figure 4 on page 8.
1.
Applying power; if CKE is maintained below 0.2 x
VCCQ, outputs remain disabled. To guarantee RTT (ODT
resistance) is off, VREF must be valid and a low level
must be applied to the ODT ball (all other inputs may be
undened, I/Os and outputs must be less than VCCQ during
voltage ramp time to avoid DDR2 SDRAM device latch-up).
At least one of the following two sets of conditions (A or B)
must be met to obtain a stable supply state (stable supply
dened as VCC, VCCQ, VREF, and VTT are between their
minimum and maximum values as stated in Table 20):
A. (single power source) The VCC voltage ramp from
300mV to VCC (MIN) must take no longer than 200ms;
during the VCC voltage ramp, |VCC - VCCQ| ≤ 0.3V.
Once supply voltage ramping is complete (when VCCQ
crosses VCC (MIN)), Table20 specications apply.
VCC, VCCQ are driven from a single power converter
output
VTT is limited to 0.95V MAX
VREF tracks VCCQ/2; VREF must be within ±0.3V with
respect to VCCQ/2 during supply ramp time
VCCQ ≥ VREF at all times
B. (multiple power sources) VCC ≥ VCCQ must be
maintained during supply voltage ramping, for both AC
and DC levels, until supply voltage ramping completes
(VCCQ crosses VCC [MIN]). Once supply voltage
ramping is complete, Table20 specications apply.
Apply VCC before or at the same time as VCCQ; VCC
voltage ramp time must be ≤ 200ms from when VCC
ramps from 300mV to VCC (MIN)
Apply VCCQ before or at the same time as VTT; the
VCCQ voltage ramp time from when VCC (MIN) is
achieved to when VCCQ (MIN) is achieved must
be ≤ 500ms; while VCC is ramping, current can be
supplied from VCC through the device to VCCQ
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| W3H32M72E-667SBC | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
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| W3H64M64E-400SBC | 64M X 64 DDR DRAM, 0.6 ns, PBGA208 |
| W3H64M72E-400ESI | 64M X 72 DDR DRAM, 0.6 ns, PBGA208 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M72E-667SB2M/T/R | 制造商:Microsemi Corporation 功能描述:PBGA,32M X72,DDR2 SDRAM, 1.8V - Tape and Reel |
| W3H32M72E-667SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H32M72E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk |
| W3H32M72E-667SBM | 制造商:PMG/Microsemi 功能描述: |
| W3H32M72E-ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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