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參數(shù)資料
| 型號： | W25Q32BVSSAP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 32M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, SOIC-8 |
| 文件頁數(shù)： | 49/79頁 |
| 文件大小： | 1090K |
| 代理商： | W25Q32BVSSAP |
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W25Q32BV
Publication Release Date: April 01, 2011
- 53 -
Revision F
7.2.32 Read Manufacturer / Device ID Dual I/O (92h)
The Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer/Device ID
instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 2x
speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “92h” followed by a
24-bit address (A23-A0) of 000000h, 8-bit Continuous Read Mode Bits, with the capability to input the
Address bits two bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are
shifted out 2 bits per clock on the falling edge of CLK with most significant bits (MSB) first as shown in
Figure 30. The Device ID values for the W25Q32BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (92h)
High Impedance
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
7
5
3
1
**
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
23
**
A23-16
A15-8
A7-0 (00h)
M7-0
/CS
CLK
DI
(IO
0)
DO
24
(IO
1)
25
26
27
28
29
30
31
32
33
34
36
37
38
35
23
0
Mode 0
Mode 3
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
6
4
2
1
0
1
MFR ID
Device ID
MFR ID
(repeat)
Device ID
(repeat)
IOs switch from
Input to Output
**
= MSB
*
Figure 30. Read Manufacturer / Device ID Dual I/O Diagram
Note:
The “Continuous Read Mode” bits M7-0 must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W25Q32BWSNIP | 4M X 8 SPI BUS SERIAL EEPROM, DSO8 |
| W25Q32BWSSIG | 4M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q40BWSNIP | 4M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q64BVSSIP | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q64CVZPAG | 64M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q32BVSSIG | 功能描述:IC SPI FLASH 32MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
| W25Q32BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 32M-BIT, 4KB UNIFORM |
| W25Q32BVSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVTCAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVTCAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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