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參數(shù)資料
| 型號： | W25Q16DWSFIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 16M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| 封裝： | 0.300 INCH, GREEN, PLASTIC, SOIC-16 |
| 文件頁數(shù)： | 2/83頁 |
| 文件大?。?/td> | 1268K |
| 代理商： | W25Q16DWSFIG |
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W25Q16DW
- 10 -
9. FUNCTIONAL DESCRIPTION
9.1 SPI/QPI OPERATIONS
Power On
Standard SPI
Dual SPI
Quad SPI
operations
QPI
operations
Device
Initialization
Enable QPI (38h)
Disable QPI (FFh)
Reset (66h + 99h)
Power On
Standard SPI
Dual SPI
Quad SPI
operations
QPI
operations
Device
Initialization
Enable QPI (38h)
Disable QPI (FFh)
Reset (66h + 99h)
Figure 3. W25Q16DW Serial Flash Memory Operation Diagram
9.1.1
Standard SPI Instructions
The W25Q16DW is accessed through an SPI compatible bus consisting of four signals: Serial Clock
(CLK), Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions
use the DI input pin to serially write instructions, addresses or data to the device on the rising edge of
CLK. The DO output pin is used to read data or status from the device on the falling edge of CLK.
SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is
not being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and
rising edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS.
9.1.2
Dual SPI Instructions
The W25Q16DW supports Dual SPI operation when using instructions such as “Fast Read Dual Output
(3Bh)” and “Fast Read Dual I/O (BBh)”. These instructions allow data to be transferred to or from the
device at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are
ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-
critical code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins
become bidirectional I/O pins: IO0 and IO1.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q16DWSFIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSNIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSNIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWSSIG | 功能描述:IC FLASH SPI 16MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:2,500 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（單線） 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) |
| W25Q16DWSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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