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參數(shù)資料
| 型號： | W25Q128BVFAP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 128M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| 封裝： | 0.300 INCH, GREEN, SOIC-16 |
| 文件頁數(shù)： | 72/74頁 |
| 文件大?。?/td> | 855K |
| 代理商： | W25Q128BVFAP |
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W25Q128BV
- 74 -
11. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/26/09
All
New Create Preliminary
B
05/22/09
45, 67 & 68
Modified tSUS description
Updated Ordering Information
C
08/20/09
65 & 66
5, 58 & 62
53
Updated package diagrams
Updated maximum operation frequency
Corrected UID Waveform
D
07/08/10
68-69
5, 61, 65
50, 54
63
5, 9, 20, 55-57
5, 70
Updated package diagrams
Updated maximum operation frequency
Corrected 90h & 9Fh waveforms
Updated Icc parameters
Added SFDP feature
Added automotive temperature
E
04/01/11
8, 71-73, 22-68,
46, 56-58
Added TFBGA package
Updated diagrams
Added /WP timing diagram
Updated Suspend description
Update SFDP to JEDEC 1.0
Removed Preliminary designator
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W25Q128BVEIP | 128M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q128BVFIP | 128M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| W25Q16CLSFIP | 16M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| W25Q16CLDAIG | 16M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| W25Q16CLZPIP | 16M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q128BVFIG | 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3.3V 128Mbit 16M x 8bit 8.5ns 16-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:128MB SPI FLASH |
| W25Q128BVFIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q128FV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q128FVAIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q128FVAIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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