AGND = REFGND = DACGND = GND
參數(shù)資料
型號： USB-I2C/LIN-CONV-Z
廠商： Analog Devices Inc
文件頁數(shù)： 18/104頁
文件大?。?/td> 0K
描述： USB TO I2C/LIN CONV BOARD
標(biāo)準(zhǔn)包裝： 1
附件類型： 適配器板
適用于相關(guān)產(chǎn)品： ARM7TDMI?
ADuC7019/20/21/22/24/25/26/27/28/29
Data Sheet
Rev. F | Page 20 of 104
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GNDREF, TA = 25°C, unless
otherwise noted.
Table 10.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION
Parameter
Rating
AVDD to IOVDD
0.3 V to +0.3 V
AGND to DGND
0.3 V to +0.3 V
IOVDD to IOGND, AVDD to AGND
0.3 V to +6 V
Digital Input Voltage to IOGND
0.3 V to +5.3 V
Digital Output Voltage to IOGND
0.3 V to IOVDD + 0.3 V
VREF to AGND
0.3 V to AVDD + 0.3 V
Analog Inputs to AGND
0.3 V to AVDD + 0.3 V
Analog Outputs to AGND
0.3 V to AVDD + 0.3 V
Operating Temperature Range, Industrial
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
θJA Thermal Impedance
40-Lead LFCSP
26°C/W
49-Ball CSP_BGA
80°C/W
64-Lead LFCSP
24°C/W
64-Ball CSP_BGA
75°C/W
64-Lead LQFP
47°C/W
80-Lead LQFP
38°C/W
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240°C
RoHS Compliant Assemblies
(20 sec to 40 sec)
260°C
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