參數(shù)資料
型號： UPD78F9510GR-JJG-A
廠商： Renesas Electronics America
文件頁數(shù)： 46/175頁
文件大小： 0K
描述： MCU 8BIT SGL CHIP 16PIN
標(biāo)準(zhǔn)包裝： 400
系列： 78K0S/Kx1+
核心處理器： 78K0S
芯體尺寸： 8-位
速度： 10MHz
外圍設(shè)備： LVD，POR，PWM，WDT
輸入/輸出數(shù)： 13
程序存儲器容量： 1KB（1K x 8）
程序存儲器類型： 閃存
RAM 容量： 128 x 8
電壓 - 電源 (Vcc/Vdd)： 2 V ~ 5.5 V
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 16-SSOP（0.173"，4.40mm 寬）
包裝： 托盤
User’s Manual U16994EJ6V0UD
12
16.8 Flash Memory Programming by Self Programming..............................................................232
16.8.1 Outline of self programming .......................................................................................................... 232
16.8.2 Cautions on self programming function ......................................................................................... 235
16.8.3 Registers used for self programming function ............................................................................... 235
16.8.4 Example of shifting normal mode to self programming mode ........................................................ 242
16.8.5 Example of shifting self programming mode to normal mode ........................................................ 245
16.8.6 Example of block erase operation in self programming mode ....................................................... 248
16.8.7 Example of block blank check operation in self programming mode ............................................. 251
16.8.8 Example of byte write operation in self programming mode .......................................................... 254
16.8.9 Example of internal verify operation in self programming mode .................................................... 257
16.8.10 Examples of operation when command execution time should be minimized in self programming
mode ........................................................................................................................................... 261
16.8.11 Examples of operation when interrupt-disabled time should be minimized in self programming
mode ........................................................................................................................................... 268
CHAPTER 17 ON-CHIP DEBUG FUNCTION .......................................................................................279
17.1 Connecting QB-MINI2 to 78K0S/KY1+ ....................................................................................279
17.1.1 Connection of INTP1 pin ............................................................................................................... 280
17.1.2 Connection of X1 and X2 pins ....................................................................................................... 281
17.2 Securing of user resources .....................................................................................................282
CHAPTER 18 INSTRUCTION SET OVERVIEW .................................................................................283
18.1 Operation ...................................................................................................................................283
18.1.1 Operand identifiers and description methods ................................................................................ 283
18.1.2 Description of “Operation” column ................................................................................................. 284
18.1.3 Description of “Flag” column.......................................................................................................... 284
18.2 Operation List ...........................................................................................................................285
18.3 Instructions Listed by Addressing Type ................................................................................290
CHAPTER 19 ELECTRICAL SPECIFICATIONS (Standard product, (A) grade product) ................293
CHAPTER 20 ELECTRICAL SPECIFICATIONS ((A2) grade product)................................................305
CHAPTER 21 PACKAGE DRAWING ..................................................................................................319
CHAPTER 22 RECOMMENDED SOLDERING CONDITIONS...........................................................323
APPENDIX A DEVELOPMENT TOOLS...............................................................................................325
A.1 Software Package ......................................................................................................................328
A.2 Language Processing Software ...............................................................................................328
A.3 Flash Memory Writing Tools .....................................................................................................329
A.3.1 When using flash memory programmer PG-FP5 and FL-PR5 ........................................................ 329
A.3.2 When using on-chip debug emulator with programming function QB-MINI2 ................................... 329
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