參數(shù)資料
型號(hào)： UPD784218GC
廠商： NEC Corp.
英文描述： Connector assemblies, Network cables;
中文描述： 16-/8-bit的單晶片微控制器
文件頁數(shù)： 83/92頁
文件大?。?/td> 617K
代理商： UPD784218GC
μ
PD784218, 784218Y
Data Sheet U12304EJ2V0DS00
83
17. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD784218 should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Caution
Soldering conditions for the
μ
PD784218YGC-
×××
-8EU and
μ
PD784218YGF-
×××
-3BA are undetermined
because these products are under development.
Table 17-1. Soldering Conditions for Surface Mount Type
(1)
μ
PD784218GC-
×××
-8EU: 100-pin plastic LQFP (Fine pitch) (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less, Exposure limit: 7 days
Note
(after that,
prebake at 125
°
C for 10 hours)
VP-15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD784218GF-
×××
-3BA: 100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or
higher), Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or
higher), Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
PDF描述
UPD784218GF 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784218Y 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784218 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784218GC-XXX-8EU 16-Bit Microcontroller
UPD784218GF-XXX-3BA 16-Bit Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD784935AGF-113-3BA 制造商:NEC Electronics Corporation 功能描述:
UPD784938AGF-188-3BA 制造商:NEC Electronics Corporation 功能描述:
UPD789104AMC(A)-968-5A4-E2 制造商:Renesas Electronics Corporation 功能描述:
UPD789104AMC-671-5A4-E1 制造商:Renesas Electronics Corporation 功能描述:
UPD789104AMC-672-5A4-E1 制造商:Renesas Electronics Corporation 功能描述:
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*