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參數(shù)資料
| 型號： | UPD72850AGK-9EU |
| 廠商： | NEC Corp. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No |
| 中文描述： | IEEE1394連接400Mbps的物理層 |
| 文件頁數(shù)： | 46/48頁 |
| 文件大小： | 290K |
| 代理商： | UPD72850AGK-9EU |
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Data Sheet S14452EJ1V0DS00
46
μ
PD72850A
9. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72850A should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 9-1. Surface Mounting Type Soldering Conditions
μ
PD72850AGK-9EU : 80-pin plastic TQFP (Fine pitch) (12 x 12 mm)
Soldering
Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).
Count: three times or less
Exposure limit: 3 days
Note
(after that prebake at 125°C for 10 hours)
IR35-103-3
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
—
Note
After opening the dry pach, store it at 25°C or less and 65% RH or less for the allowable storage period.
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