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參數(shù)資料
| 型號： | TSPC860XRMZQU66D |
| 廠商： | Atmel Corp. |
| 英文描述： | Integrated Communication Processor |
| 中文描述： | 綜合通信處理器 |
| 文件頁數(shù)： | 86/93頁 |
| 文件大?。?/td> | 1601K |
| 代理商： | TSPC860XRMZQU66D |
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86
TSPC860 [Preliminary]
2129B–HIREL–12/04
Preparation for Delivery
Marking
Each microcircuit is legible and permanently marked with the following information at
minimum:
ATMEL logo
Manufacturer’s part number
Class B identification if applicable
Date-code of inspection lot
ESD identifier if available
Country of manufacturing
Packaging
Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.
Certificate of Compliance
Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-
ucts are in compliance either with MIL-STD-883 and guarantying the parameters not
tested at temperature extremes for the entire temperature range.
Handling
MOS devices must be handled with certain precautions to avoid damage due to accu-
mulation of static charge. Input protection devices have been designed in the chip to
minimize the effect of this static buildup. However, the following handling practices are
recommended:
a) Devices should be handled on benches with conductive and grounded surfaces
b) Ground test equipment, tools and operator
c) Do not handle devices by the leads
d) Store devices in conductive foam or carriers
e) Avoid use of plastic, rubber, or silk in MOS areas
f) Maintain relative humidity above 50% if practical
Package Mechanical Data
Package Parameters
The TSPC860 uses a 25 mm
×
25 mm, 357 pin Plastic Ball Grid Array (PBGA) package.
The plastic package parameters are as provided in the following list.
Package Outline
25 mm × 25 mm
Interconnects
357
Pitch
1.27 mm
Solder Attach
62 Sn/36 Pb/2 Ag
Solder Balls
62 Sn/36 Pb/2 Ag
Table 28.
Package Description
Package Designator
Package Description
ZP
PBGA 357 25*25*0.9P1.27
SQ/VR
PBGA 357 25*25*1.2P1.27
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