參數(shù)資料
型號： TSPC860XRMZQU66D
廠商： Atmel Corp.
英文描述： Integrated Communication Processor
中文描述： 綜合通信處理器
文件頁數(shù)： 29/93頁
文件大?。?/td> 1601K
代理商： TSPC860XRMZQU66D
29
TSPC860 [Preliminary]
2129B–HIREL–12/04
Package
The macrocircuits are packaged in 357-lead Plastic Ball Grid Array (BGA) packages.
The precise case outlines are described at the end of the specification.
Absolute Maximum
Ratings
Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and affect
reliability.
Notes:
1. Junction temperature is a function on on-chip power dissipation, package thermal resistance, mounting site (board) temper-
ature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages
where the pad would be expected to be soldered, junction to case thermal resistance is a simlated value from the junction to
the exposed pas without contact resistance.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction tempera-
ture per JEDEC JESD51-2.
Absolute Maximum Rating for the TSPC860
Parameter
Symbol
Min
Max
Unit
I/O Supply Voltage
V
DDH
-0.3
4.0
V
Internal Supply Voltage
V
DDL
-0.3
4.0
V
Backup Supply Voltage
KAPWR
-0.3
4.0
V
PLL Supply Voltage
V
DDSYN
-0.3
4.0
V
Input Voltage
V
IN
-0.3
4.0
V
Storage Temperature Range
T
STG
-65
+150
°
C
Table 4.
Thermal Characteristics
Rating
Environnement
Symbol
ZP
PC860P
ZQ/VR
PC860P
Unit
Junction to Ambient
(1)
Natural Convection
Single layer board (1s)
R
θ
JA
(2)
34
34
°
C/W
Four layer board (2s2p)
R
θ
JMA
(3)
22
22
Air Flow (200 ft/min)
Single layer board (1s)
R
θ
JMA
(3)
27
27
Four layer board (2s2p)
R
θ
JMA
(3)
18
18
Junction to Board
(4)
R
θ
JB
14
13
Junction to Case
(5)
R
θ
JC
ψ
JT
6
8
Junction to Package Top
(6)
Natural Convection
2
2
Air Flow (20 ft/min)
2
3
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