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D-1
Appendix D
Mechanical Data
FN020, FN028, FN044, FN052, FN068, and FN084
plastic J-leaded chip carrier
Each of these chip carrier packages consists of a circuit mounted on a lead frame and
enncapsulated within an electrically nonconductive plastic compound. The compound
withstands soldering temperatures with no deformation, and circuit performance
characteristics remain stable when the devices are operated in high-humidity conditions.
The package is intended for surface mounting on 1,27 (0.050) centers. Leads require no
additional cleaning or processing when used in soldered assembly.
–E–
–G–
–C–
–C–
S
S
S
20 19 18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
(20-PIN package used for illustration)
FN020, FN028, FN044, FN052, FN068, and FN084
1,52 (0.060) MIN
0,64 (0.025)
MIN
0.18 (0.007)
F–G
D–E
0.18 (0.007)
0.38 (0.015)
D–E
D2, E2
(see Note
F)
D3, E3
(see Note
F)
1,27 (0.050) T.P.
4 Sides
0,51 (0.020) MIN
Seating Plane
(see Note B)
0.10 (0.004)
1,14 (0.045)
F–G
0.38 (0.015)
0,51 (0.020) R.
MAX
3 Places
0.18 (0.007)
2 Sides (see Note E)
B
A
–H–
A1
A
2 Places
B
B
(0.002 IN./IN.)
0.18 (0.007)
D–E
D–E
0.18 (0.007)
–A–
B
D
S
–D–
Designation per JEDEC Std 30:
S-PLCC-J20
S-PLCC-J44
S-PLCC-J68
S-PLCC-J28
S-PLCC-J52
S-PLCC-J84
S
S
D1 (see Note B)
S
S
S
(see Note C)
1,22 (0.048)
1,07 (0.042)
S
0
S
A
S
F
E1
–
S
0
S
A
S
F
(
–
(see Note C)
(see Note C)
0,53 (0.021)
0,33 (0.013)
M
M
S
S
0,36 (0.014)
0,20 (0.008)
(Includes Lead Finish)
0,81 (0.032)
1,42 (0.056)
1,07 (0.042)
(see Note D)
S
S
S
S
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
(see table on following page for additional dimensions)
E
(
Sum of Dam Bar Protrusions
to be 0,18 (0.007) Maximum
Per Lead
NOTES: A. All dimensions conform to JEDEC Specification MO-047AA/AF. Dimensions and tolerancing are per ANSI
Y14.5M – 1982.
B. Dimensions D1 and E1 do not include mold flash protrusion. Protrusion shall not exceed 0,25 (0.010) on any
side. Centerline of center pin each side is within 0,10 (0.004) of package centerline by dimension B. The lead
contact points are planar within 0,10 (0.004).
C. Datums D – E and F – G for center leads are determined at datum – H – .
D. Datum – H – is located at top of leads where they exit plastic body.
E. Location of datums – A – and – B – to be determined at datum – H – .
F. Determined at seating plane – C – .