參數(shù)資料
型號(hào)： THMC50SSOPDBQ
廠商： Texas Instruments, Inc.
英文描述： KPT 55C 55#20 SKT RECP
中文描述： 遠(yuǎn)程/本地溫度監(jiān)視器和通風(fēng)機(jī)的SMBus接口控制器
文件頁數(shù)： 4/32頁
文件大?。?/td> 437K
代理商： THMC50SSOPDBQ
THMC50
REMOTE/LOCAL TEMPERATURE MONITOR AND
FAN CONTROLLER WITH SMBus INTERFACE
SLIS090 – JULY 1999
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating case temperature (see Note 1) (unless otherwise noted)
Voltage on VCC3AUX supply terminal, V
(VCC3AUX)
Maximum voltage allowed for FAN_OFF pullup, V
(FAN_OFF)
Input voltage on any I/O terminals (except analog inputs), V
(IOIN)
Input current on any I/O terminal (see Note 2), I
(IOIN)
Package input current (see Note 2), I
(PACKAGE)
Input voltage on REMOTE_DIODE– terminal,V
(REMOTE_DIODE–)
REMOTE_DIODE– input current, I
(REMOTE_DIODE–)
Human body model ESD susceptibility, V
(HBMESD)
Continuous power dissipation (see Note 3), P
D
Operating case temperature range, T
C
Storage temperature (see Note 4), T
stg
Junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 sec), T
(LEAD)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltages are measured with respect to GND, unless otherwise specified.
2. The 20-mA maximum package input current rating limits the number of terminals that can safely exceed the power supplies with
an input current of 5 mA to four terminals.
3. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax,
θ
JA and the ambient
temperature, TA. The maximum allowable power dissipation at any temperature is PD = (TJmax – TA)/
θ
JA.
4. Solder accordingly to IPC standards.
–0.3 V to 5.75 V
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 V
–0.3 V to V
(VCC3AUX)
+0.3 V
–5 mA to 5 mA
–20 mA to 20 mA
–0.3 V to 0.8 V
–1 mA to 1 mA
±
2 kV
330 mW
–40
°
C to 125
°
C
–65
°
C to 165
°
C
150
°
C
300
°
C
dc electrical characteristics, V
CC3
= V
(VCC3AUX)
= 3.3 V, T
A
= 25
°
C (unless otherwise noted)
power supply
PARAMETER
VCC3AUX reset generator
supply voltage
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V(VCC3AUX RST)
V(VCC3AUX_RST)
Voltage on VCC3AUX needed to guarantee
RST and AUXRST to stay valid
1
3.8
V
VCC3AUX supply voltage
Normal operating supply voltage for all other
THMC50 circuits
3
3.3
3.8
V
I(VCC3AUX)
Supply current
(interface inactive)
Exclude D/A converter source/sink current
1
2
mA
I(VCC3AUX_STANDBY)
Standby mode
500
μ
A
voltage supervisors
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VTHAUXRST
Threshold voltage on VCC3AUX for
AUXRST active
Reduce VCC3AUX from 3.8 V until AUXRST
is low.
2.88
3
V
VTHRST
Threshold voltage on VCC3 for RST
active
Reduce VCC3 from 3.8 V until RST is low
with VCC3AUX = 3.3 V
2.88
3
V
temperature-to-digital converter
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
T(ACC)
Measured temperature accuracy
–40
°
C
≤
TA < 60
°
C and
100
°
C <TA
≤
125
°
C
60
°
C
≤
TA
≤
100
°
C
Design parameter – not tested
–5
5
°
C
y
–3
3
T(RES)
V(THRESH)
Temperature resolution
1
°
C
V
Remote_Diode+ open fault threshold
2.4
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