參數資料
型號: TDA8357J
廠商: NXP SEMICONDUCTORS
元件分類: 偏轉
英文描述: Full bridge current driven vertical deflection output circuit in LVDMOS(LVDMOS中的整橋電流驅動的垂直偏轉輸出電路)
中文描述: VERTICAL DEFLECTION IC, PZIP9
封裝: POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN
文件頁數: 15/16頁
文件大?。?/td> 96K
代理商: TDA8357J
1999 Nov 10
15
Philips Semiconductors
Preliminary specification
Full bridge vertical deflection output circuit
in LVDMOS
TDA8357J
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of this specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
相關PDF資料
PDF描述
TDA8358 Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier
TDA8358J Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier(帶水平放大器的LVDMOS中的整橋電流驅動的垂直偏轉輸出電路)
TDA8359J Full bridge vertical deflection output circuit in LVDMOS
TDA8366H I2C-bus controlled PAL/NTSC TV processor
TDA8366 IIC-bus controlled PAL/NTSC TVprocessor(IIC總線控制的PAL/NTSC TV處理器)
相關代理商/技術參數
參數描述
TDA8358 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier
TDA8358J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier
TDA8359J 制造商:Distributed By MCM 功能描述:Lvdmos Philips IC 9-Pin Zip
TDA8359J/N2,112 功能描述:視頻 IC FULL BDG VERT DEFL RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
TDA8359JU 功能描述:視頻 IC FULL BDG VERT DEFL O/P CIRC RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel