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參數(shù)資料
| 型號(hào)： | TDA8357J |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 偏轉(zhuǎn) |
| 英文描述： | Full bridge current driven vertical deflection output circuit in LVDMOS(LVDMOS中的整橋電流驅(qū)動(dòng)的垂直偏轉(zhuǎn)輸出電路) |
| 中文描述： | VERTICAL DEFLECTION IC, PZIP9 |
| 封裝： | POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN |
| 文件頁(yè)數(shù)： | 14/16頁(yè) |
| 文件大小： | 96K |
| 代理商： | TDA8357J |
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1999 Nov 10
14
Philips Semiconductors
Preliminary specification
Full bridge vertical deflection output circuit
in LVDMOS
TDA8357J
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
SOT523-1
0
10 mm
5
scale
w
M
bp
Dh
q1
Z
1
9
e
e1
m
e2
x
A2
non-concave
D1
P
D
k
q2
L3
L2
L
Q
c
E
98-11-12
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
view
B
: mounting base side
B
UNIT
bp
L1
c
D
(1)
Dh
L
q2
mm
2.7
2.3
A2
(2)
0.80
0.65
0.58
0.48
13.2
12.8
D1
(2)
6.2
5.8
3.5
Eh
3.5
e
2.54
e1
1.27
e2
5.08
4.85
Q
E
(1)
14.7
14.3
Z
(1)
1.65
1.10
11.4
10.0
L2
6.7
5.5
L3
4.5
3.7
3.4
3.1
1.15
0.85
q
17.5
16.3
q1
2.8
m
0.8
v
3.8
3.6
3.0
2.0
12.4
11.0
P
k
0.02
x
0.3
w
Eh
L1
q
v
M
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8358 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier |
| TDA8358J | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full bridge vertical deflection output circuit in LVDMOS with east-west amplifier |
| TDA8359J | 制造商:Distributed By MCM 功能描述:Lvdmos Philips IC 9-Pin Zip |
| TDA8359J/N2,112 | 功能描述:視頻 IC FULL BDG VERT DEFL RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| TDA8359JU | 功能描述:視頻 IC FULL BDG VERT DEFL O/P CIRC RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
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