
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CONDUCTIVE POLYMER CHIP CAPACITORS
The iron should be used to heat the solder pad,
applying solder between the pad and the termina-
tion, until reflow occurs. The iron should be
removed. “Wiping” the edges of a chip and heating
the top surface is not recommended.
During typical reflow operations a slight darkening
of the gold-colored epoxy may be observed. This
slight darkening is normal and is not harmful to the
product. Marking permanency is not affected by
this change.
The EIA standards for conductive polymer capaci-
tors allows an ESR movement to 1.1 times (or 3 mil-
liohms, whichever is greater) the catalog limit past
mounting.
33. Washing
Standard washing techniques and solvents are
compatible with all KEMET surface mount tantalum
capacitors. Solvents such as Freon TMC and TMS,
Trichlorethane, methylene chloride, prelete, and iso-
propyl alcohol are not harmful to these compo-
nents. Please note that we are not endorsing the
use of banned or restricted solvents. We are simply
stating that they would not be harmful to the com-
ponents.
If ultrasonic agitation is utilized in the cleaning
process, care should be taken to minimize energy
levels and exposure times to avoid damage to the
terminations.
KEMET tantalum chips are also compatible with
newer aqueous and semi-aqueous processes.
34. Encapsulations
Under normal circumstances, potting or encapsula-
tion of KEMET tantalum chips is not required.
35. Storage Environment
Conductive polymer series (T520, T525, T530) are
shipped in moisture barrier bags with a desiccant
and moisture indicator card. These series are clas-
sified as MSL (Moisture Sensitivity Level 3). Upon
opening the moisture barrier bag, parts should be
mounted within 7 days to prevent moisture absorp-
tion and outgassing. If the 7 day window is exceed-
ed, the parts can be baked per the instructions on
the bag (168 hours at 40±5oC).
Series
Case Size
Typical Weight
(mg)
35
65
T52x
T52x
A/3216-18
B/3528-21
T52x
T52x
T52x
T52x
T52x
C/6032-28
D/7343-31
X/7343-43
T/3528-12
W/7343-15
130
325
500
38
172
T52x
T530
T530
T530
T530
V/7343-20
D/7343-31
Y/7343-40
X/7343-43
E/7360-38
210
342
480
515
650
COMPONENT WEIGHTS
Polymer chip capacitors should be stored in normal
working environments. While the chips themselves
are quite robust in other environments, solderability
will be degraded by exposure to high temperatures,
high humidity, corrosive atmospheres, and long
term storage. In addition, packaging materials will
be degraded by high temperature - reels may soft-
en or warp, and tape peel force may increase.
KEMET recommends that maximum storage tem-
perature not exceed 40 degrees C, and the maxi-
mum storage humidity not exceed 60% relative
humidity. In addition, temperature fluctuations
should be minimized to avoid condensation on the
parts, and atmospheres should be free of chlorine
and sulfur bearing compounds. For optimized sol-
derability, chip stock should be used promptly,
preferably within 1.5 years of receipt.
49
C