
11. AC Power Dissipation
Power dissipation is a function of capacitor size
and materials. Maximum power ratings have been
established for all case sizes to prevent overheat-
ing. In actual use, the capacitor’s ability to dissi-
pate the heat generated at any given power level
may be affected by a variety of circuit factors.
These include board density, pad size, heat sinks
and air circulation.
TABLE 5 Tantalum Chip Power Dissipation Ratings
12. AC Operation
Permissible AC ripple voltage and current are
related to equivalent series resistance (ESR) and
power dissipation capability.
Permissible AC ripple voltage which may be
applied is limited by three criteria:
a. The positive peak AC voltage plus the DC
bias voltage, if any, must not exceed the DC
voltage rating of the capacitor.
b. The negative peak AC voltage, in combination
with the bias voltage, if any, must not exceed
the permissible reverse voltage ratings pre-
sented in Table 3.
c. The power dissipated in the ESR of the capa-
citor must not exceed the appropriate value
specified in Table 5.
Actual power dissipated may be calculated from
the following:
P =l
Substituting I = E
Z
where:
I = rms ripple current (amperes)
E = rms ripple voltage (volts)
P = power (watts)
Z = impedance at specified frequency (ohms)
R = equivalent series resistance at specified
frequency (ohms)
Using P max from Table 5, maximum allowable
rms ripple current or voltage may be determined
as follows:
I (max) =
These values should be derated at elevated tem-
peratures as follows:
Temperature
85 C
125 C
ENVIRONMENTAL
13. Temperature Stability
TABLE 6 Temperature Stability Limits
2
R
P max/
R
E (max) = Z
P max/
R
Derating Factor
.9
.4
Step
No.
Leakage
Current
Dissipation
Factor
within original
limit
within original
limit**
within original
limit**
within original
limit***
within original
limit***
Temp.
+25 C
Capacitance
within specified within original
tolerance
within ± 10%
of initial value
within ± 5%
of initial value
within ± 10%
of initial value
+125 C *within ± 12%or within 12X
20% of initial
value
+25 C
within ± 5%
of initial value
*
+12% is standard. +15% or +20% applies to certain CV values
Contact KEMET representative for details.
**within 1.5x initial limit for extended CV values.
***within 1.15x initial limit for extended CV values.
1
limit
N/A
2
-55 C
3
+25 C
within original
limit
within 10X
original limit
4
+ 85 C
5
original limit
6
within original
limit
within original
limit
SOLID TANTALUM CHIP CAPACITORS
P = E
2
R
Z
2
,
S
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
9
FIGURE 9b ESR & Impedance (z) vs Frequency
ESR and Z are also affected by temperature. At
100 kHz, ESR decreases with increasing temper-
ature. The amount of change is influenced by the
size of the capacitor and is generally more pro-
nounced on smaller ratings.
TANTALUM MnO
2
COMPONENT PERFORMANCE CHARACTERISTICS
(con’t.)
KEMET
R
S
T
U
V
A
B
C
D
X
E
T530D
T510X, T530X
T510E, T530E
EIA
2012-12
3216-12
3528-12
6032-15
7343-20
3216-18
3528-21
3062-28
7343-31
7343-43
7260-38
7343-31
7343-43
7260-38
200
255
270
285
85
110
150
165
Case Code
Maximum Power Dissipation
mW @ +25°C w/+20°C Rise
25
60
70
90
125
75
FIGURE 10
Typical Effect of Temperature on 100 kHz ESR