
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
to maximize the intergrity of the solder joint, and to
minimize component rework due to unacceptable
solder joints.
Figure 5 illustrates pad geometry. The table pro-
vides recommended pad dimensions for reflow sol-
dering techniques. These dimensions are intended
to be a starting point for circuit board designers, to
be fine tuned, if necessary, based upon the pecu-
liarities of the soldering process and/or circuit board
design.
Visit KEMET.com for Engineering Bulletin Number
F-2100 entitled “Surface Mount Mounting Pad
Dimensions and Considerations” for further details
on this subject.
32. Soldering
The T52X KO-CAP family has been designed for
reflow solder processes. Solder-coated terminations
have excellent wetting characteristics for high integrity
solder fillets. Preheating of these components is rec-
ommended to avoid extreme thermal stress. Pb (lead)
Free peak temperature is 260C (with up to 3x reflow
capabilities).
Hand-soldering should be avoided. If necessary, it
should be performed with care due to the difficulty
in process control. Care should be taken to avoid
contact of the soldering iron to the molded case.
APPLICATIONS
29. Handling
Automatic handling of encapsulated components is
enhanced by the molded case which provides com-
patibility with all types of high speed pick and place
equipment. Manual handling of these devices pre-
sents no unique problems. Care should be taken
with your fingers, however, to avoid touching the
solder-coated terminations as body oils, acids and
salts will degrade the solderability of these termina-
tions. Finger cots should be used whenever manu-
ally handling all solderable surfaces.
30. Termination Coating
KEMET’s standard termination finish is 100% Sn.
Standard terminations can be ordered with a “T”
suffix in the lead material designator of the KEMET
part number. Components ordered with the “T” suf-
fix are Pb-Free/RoHS compliant and are backward
and forward compatible with SnPb and Pb-Free sol-
dering processes.
90Sn/10Pb terminations are also available and can
be ordered with an “H” suffix.
KEMET’s “S” suffix remains an active termination
designator for current designs but is not recom-
mended for new designs. Parts ordered with an “S”
suffix are not guaranteed to be Pb-Free or RoHS
compliant. Refer to www.kemet.com for information
on Pb-Free transition.
31. Recommended Mounting Pad Geometries
Proper mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
COMPONENT PERFORMANCE CHARACTERISTICS
CONDUCTIVE POLYMER CHIP CAPACITORS
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Time (Seconds)
T
60 Sec.
45 Sec.
45 Sec.
5 Sec.
95 Sec.
90 Sec.
Sn-Pb Profile
Pb-Free Profile
260C Peak Temperature (3 Passes)
Time/Temperature Soldering Profile
Table 6 - Land Pattern Dimensions for Reflow Solder
Pad Dimensions
Y
C
Z
G
X
(ref) (ref)
B/3528-21, T/3528-12
C/6032-28
D/7343-31, V/7343-20,
W/7343-15, X/7343-43,
Y/7343-40
5.00 1.10 2.50 1.95 3.05
7.60 2.50 2.50 2.55 5.05
8.90 3.80 2.70 2.55
6.35
KEMET/EIA Size Code
48