參數(shù)資料
型號: T35L3232B-4T
廠商: TM Technology, Inc.
英文描述: 32K x 32 SRAM
中文描述: 32K的× 32的SRAM
文件頁數(shù): 5/19頁
文件大?。?/td> 261K
代理商: T35L3232B-4T
TE
CH
tm
FLOW-THROUGH READ TIMING
Preliminary T35L3232B
Taiwan Memory Technology, Inc. reserves the right
to change products or specifications without notice.
P. 13
Publication Date: FEB. 2000
Revision:0.A
Note:
1. Q(A2) refers to output from address A2. Q (A2 + 1) refers to output from the next internal burst
address following A2.
2.
CE2
and CE2 have timing identical to
CE
. On this diagram, when
CE
is LOW,
CE2
is LOW
and CE2 is HIGH. When
CE
is HIGH,
CE2
is HIGH and CE2 is LOW.
3. Timing is shown assuming that the device was not enabled before entering into this sequence.
OE
does not cause Q to be driven until after the following clock rising edge.
4. Output are disabled tKQHZ after diselect.
High-Z
BURST READ
CLK
ADSC
ADSP
ADDRESS
GW, BWE,
BW1-BW4
tKC
tKH
tKL
tADSStADSH
DON'T CARE
UNDEFINED
tADSS
tADSH
tAS
tAH
tW S
tW H
tCEStCEH
tAAS
tAAH
tOEQ
tKQX
tOELZ
tOEHZ
tKQ
tKQHZ
tKQ
tKQLZ
Single READ
Q(A1)
Q(A2)
Q(A2+1)
Q(A2+2)
Q(A2+3)
Q(A2+1)
Burst wraps around to
its inital state.
ADV suspends burst.
Q(A2)
A2
A 1
(NOTE1)
CE
(NOTE2)
ADV
O E
Q
Deselect Cycle
(NOTE 4)
Q(A2+2)
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