參數(shù)資料
型號(hào): STPCI2GDY
廠商: 意法半導(dǎo)體
英文描述: X86 Core PC Compatible System-on-Chip for Terminals
中文描述: x86內(nèi)核PC兼容系統(tǒng)上的終端芯片
文件頁數(shù): 72/111頁
文件大?。?/td> 1896K
代理商: STPCI2GDY
MECHANICAL DATA
72/111
Issue 1.0 - July 24, 2002
5.2. 516-PIN PACKAGE THERMAL DATA
516-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
The structure in shown in
Figure 5-4
.
Thermal dissipation options are illustrated in
Figure 5-5
and
Figure 5-6
.
Figure 5-4. 516-Pin PBGA Structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal Dissipation Without Heatsink
Ambient
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the centre balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17μm for internal layers
- 34μm for external layers
Board
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PDF描述
STPCI2HEYC X86 Core PC Compatible System-on-Chip for Terminals
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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