參數(shù)資料
型號: STP2223BGA
元件分類: 總線控制器
英文描述: PCMCIA BUS CONTROLLER, PBGA456
封裝: PLASTIC, BGA-456
文件頁數(shù): 26/34頁
文件大?。?/td> 476K
代理商: STP2223BGA
32
STP2223BGA
UPA to PCI Interface
U2P
July 1997
Package Drawing
35.00
±0.20
0.56
± 0.04
25 SPACES @ 1.27 = 31.75
0.60
± 0.10
30.00
+0.70
-0.00
22.00 REF.
All Measurements in Millimeters
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
1
3
5
7
9
11
13
15
17
19
21
23
25
2
4
6
8
10
12
14
16
18
20
22
24
26
SOLDER BALL GRID
ARRAY COORDINATES
ARE FOR REFERENCE
ONLY
A1 INDICATOR
(UNDER COVER COAT)
1.63 TYP
0.75
± 0.15 DIA
TYP AFTER REFLOW
25
SPACES
@
1.27
=
31.75
1
3
5
7
9
1113151719212325
2
4
6
8
10
12
14
16
18
20
22
24
26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
SQUARE
30
°
APPROX
ALL SIDES
1.63
TYP
APPROX
TYP 4 PLACES
17.50
±0.20
A1 INDICATOR
(GOLD PLATED)
SOLDER BALL GRID
ARRAY COORDINATES
ARE FOR REFERENCE
ONLY
SEE NOTE 2
2.33
± 0.19
TOP VIEW
BOTTOM VIEW
D 0.19 C
SEATING PLANE
SEE NOTE 1
TYP
—C—
1.73
± 0.09
// 0.15 C
NOTES:
1. Seating Plane is “best Fit” plane
as determined by coplanarity
measurement equipment.
2. The flatness of the overmold
surface in the center 12 x 12 mm
area shall be within 0.13 mm.
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