參數(shù)資料
型號: SL1ICS3001
廠商: NXP Semiconductors N.V.
英文描述: I.CODE1 Label IC Chip Specification
中文描述: I.CODE1標(biāo)簽IC芯片規(guī)格
文件頁數(shù): 5/22頁
文件大?。?/td> 376K
代理商: SL1ICS3001
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 5 of 22
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of ICODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery
of tested ICODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer (Prod. Spec.)
General Quality Specification
ICODE1 Label IC, Coil Design Guide
This product specification is valid for VCOL1V0 from mask revision P/B upwards.
4 Ordering Information
Following ordering options are available:
Type Name
SL1 ICS30 01W/N5D
SL1 ICS30 01U/N5D
SL1 ICS30 01U/L6D
Description
Sawn wafer on foil (FFC), 150 μm, inked and mapped
Unsawn wafer, 150 μm, inked and mapped
Unsawn wafer, 525 μm, mapped (
not
inked)
Ordering Code
9352 644 66005
9352 644 65025
9352 644 64025
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SL1ICS3001U 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification
SL1ICS3001U/L6D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification
SL1ICS3001U/N5D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification
SL1ICS3001W 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification
SL1ICS3001W/N4D 功能描述:射頻無線雜項 ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel