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參數(shù)資料
| 型號： | SL1ICS3001 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC Chip Specification |
| 中文描述： | I.CODE1標簽IC芯片規(guī)格 |
| 文件頁數(shù)： | 2/22頁 |
| 文件大?。?/td> | 376K |
| 代理商： | SL1ICS3001 |
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 2 of 22
1 Contents
1
CONTENTS
2
2
DEFINITIONS
2.1
Life Support Applications ....................................................................................................4
2.2
Abbreviations ........................................................................................................................4
4
3
SCOPE
5
4
ORDERING INFORMATION
5
5
FUNCTIONAL DESCRIPTION
5.1
Basic Features.......................................................................................................................6
5.2
Block Diagram of the IC.......................................................................................................6
5.3
Memory Organisation...........................................................................................................7
5.3.1
Serial Number...................................................................................................................7
5.3.2
Write Access Conditions..................................................................................................7
5.3.3
Special Functions (EAS/QUIET).....................................................................................8
5.3.4
Family Code and Application Identifier...........................................................................8
5.3.5
Configuration of delivered ICs.........................................................................................8
6
6
MECHANICAL DIE SPECIFICATIONS
9
7
MECHANICAL WAFER SPECIFICATIONS
7.1
Wafer Status ........................................................................................................................10
7.2
Backside Treatment ............................................................................................................10
10
8
DOCUMENTATION
11
8.1
8.2
Delivery Documentation.....................................................................................................11
Fail-Die Identification.........................................................................................................11
8.2.1
Ink Dot Specification......................................................................................................11
8.2.2
Wafer Mapping...............................................................................................................11
9
QUALITY ASSURANCE
12
9.1
9.2
Electrical Acceptance Test.................................................................................................12
Visual Inspection.................................................................................................................12
9.2.1
After Wafer Final Test....................................................................................................12
9.2.2
After Sawing (Film Frame Carrier)................................................................................12
10
PACKING
13
10.1 Storage Recommendations.................................................................................................13
10.2 Possible Forms of Delivery.................................................................................................13
10.2.1 Packing of Unsawn Wafers............................................................................................13
10.2.2 Packing of Sawn Wafers................................................................................................13
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3001U | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W/N4D | 功能描述:射頻無線雜項 ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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