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參數(shù)資料
| 型號(hào)： | SL1ICS3001 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC Chip Specification |
| 中文描述： | I.CODE1標(biāo)簽IC芯片規(guī)格 |
| 文件頁數(shù)： | 10/22頁 |
| 文件大?。?/td> | 376K |
| 代理商： | SL1ICS3001 |
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 10 of 22
7 Mechanical Wafer Specifications
For further information as described in the following chapters please refer to the following
Philips documents:
Dicing Guidelines for Thin Wafers (< 200 μm)
General Specification for 6” Wafer (Prod. Spec.)
In case of doubt or inconsistency with the following chapters the above mentioned specifications
are applicable.
Designation:
each wafer is laser scribed with batch and wafer number
Wafer diameter:
150 mm (6")
±
0.3 mm
Die separation lane width:
80 μm (Scribe line)
Electrical connection of substrate:
VSS
Geometrically complete dies per wafer:
approx. 7400
Orientation of dies relat. to wafer flat:
see attached cluster map
Position of test structures:
see attached cluster map
Wafer layout:
see attached cluster map
Batch size:
24 wafers
Process:
6C15 IDFW
7.1 Wafer Status
Tested, unsawn
Tested, sawn on FFC
Minimum yield per lot:
30 %
7.2 Backside Treatment
Wafers can be delivered with a thickness of 525 μm (untreated) or with 150
μ
m
±
15 μm (approx.
6 mil) grinded and etched backside.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3001U | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC Chip Specification |
| SL1ICS3001W/N4D | 功能描述:射頻無線雜項(xiàng) ICODE 1 FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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