參數(shù)資料
型號: SL1ICS3001
廠商: NXP Semiconductors N.V.
英文描述: I.CODE1 Label IC Chip Specification
中文描述: I.CODE1標簽IC芯片規(guī)格
文件頁數(shù): 13/22頁
文件大小: 376K
代理商: SL1ICS3001
ICODE
1 Chip Specification
Rev. 2.1
May 2000
SL040521.doc/M
Public
Page 13 of 22
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips
‘General Specification for 6” Wafer (Prod. Spec.)’.
10.1 Storage Recommendations
Unsawn/sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
Climate atmosphere:
Duration of storage:
15 ... 25 °C
40 ... 60 % r.h. or dried N
2
(only unsawn wafers!)
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Possible Forms of Delivery
10.2.1 Packing of Unsawn Wafers
Delivery form:
wafer box
10.2.2 Packing of Sawn Wafers
Delivery form:
Foil thickness:
Foil material:
Film Frame Carrier (standard Philips carrier type P7)
0.55 ... 0.85 mm
sticky foil
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